多通訊協定模組

結果: 1,621
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u-blox 多通訊協定模組 M.2 card with MAYA-W271, single package
23在途量
最少: 1
倍數: 1

M2-MAYA-W2 2.4 GHz, 5 GHz 18 dBm, 20 dBm I2S, UART 1.8 V 3.3 V u.FL 22 mm x 30 mm x 2.8 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
Adafruit 多通訊協定模組 ESP32-C6-WROOM-1-N8 Engineering Module - 8 MB Quad SPI Flash - PCB Antenna
15預期7/12/2026
最少: 1
倍數: 1

Bulk
Silicon Labs 多通訊協定模組 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 192kB RAM, Secure Vault Mid, Certified 99庫存量
最少: 1
倍數: 1

MGM240L 2.4 GHz Cut Tape
NXP Semiconductors 多通訊協定模組 IW610BHN/A1ZDI
25預期29/10/2026
最少: 1
倍數: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多通訊協定模組 IW610CHN/A1ZDI
25預期29/10/2026
最少: 1
倍數: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors 多通訊協定模組 IW610FHN/A1ZDI
25預期29/10/2026
最少: 1
倍數: 1
: 2,700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多通訊協定模組 IW611HN/A1C
25預期29/10/2026
最少: 1
倍數: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
NXP Semiconductors 多通訊協定模組 IW612HN/A1I
100預期29/10/2026
最少: 1
倍數: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel, Cut Tape
Murata Electronics 多通訊協定模組 Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
2,675在途量
最少: 1
倍數: 1
: 1,000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel
Advantech 多通訊協定模組 Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R,M.2 2230 E key (Wi-Fi: PCIe/BT:USB)
16在途量
最少: 1
倍數: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7
Adafruit 5344
Adafruit 多通訊協定模組 ESP32 Dual Antenna WiFi + Bluetooth Module with 8MB FLASH - ESP32-WROOM-DA-N8
4預期9/10/2026
最少: 1
倍數: 1

2.4 GHz 0 dBm, 19.5 dBm ADC, DAC, GPIO, I2C, I2S, IR, PWM, SD Card, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 35.6 mm x 34.4 mm x 3.5 mm Bluetooth, Bluetooth 4.2 802.11 b/g/n
Murata Electronics 多通訊協定模組 Type 1MW Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0 Combo
2,000預期31/12/2026
最少: 1
倍數: 1
: 1,000

MW 2.4 GHz, 5 GHz 17 dBm I2S, SDIO, UART 1.62 V 3.63 V - 30 C + 85 C External 7.9 mm x 7.3 mm x 1.1 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel, Cut Tape, MouseReel
apf.audio 多通訊協定模組 Tiliqua is a flexible FPGA development platform for audio/video creativity, combining modular hardware, real-time reconfiguration, and open-source tools into a single Eurorack module
39在途量
最少: 1
倍數: 1

Tiliqua USB 3.3 VDC 5 VDC Bulk
Quectel 多通訊協定模組 Cat 4 + 3G + 2G, 4Gbit ROM+2Gbit RAM, Support B5, EMEA, South Korea, Thailand, India
250在途量
最少: 1
倍數: 1
: 250

700 MHz to 960 MHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C External 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多通訊協定模組 Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, South Korea, Thailand, India
375在途量
最少: 1
倍數: 1
: 100

698 MHz to 960 MHz, 1.561 GHz, 1.575 GHz, 1.7 GHz to 2.7 GHz, 2.4 GHz to 2.5 GHz I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C External 30 mm x 51 mm x 4.9 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多通訊協定模組 Cat 1 + 3G + 2G, 1Gbit ROM+1Gbit RAM, Global
250在途量
最少: 1
倍數: 1
: 250

33 dBm ADC, I2C, PCM, SD Card, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS Reel, Cut Tape
Quectel 多通訊協定模組 Cat 4 + 3G + 2G, 1Gbit ROM+1Gbit RAM, EMEA only
743在途量
最少: 1
倍數: 1
: 250

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 29 mm x 25 mm x 2.3 mm LTE Cat 4 GNSS Reel, Cut Tape
Silex Technology 多通訊協定模組 [Sample SKU] SX-PCEAC2 is a 2.4 GHz / 5GHz dual band IEEE802.11 a/b/g/n/ac WLAN, Bluetooth 5.0 BR/EDR/LE module based and Low power PCI express interface on Qualcomm QCA6174A-5 chipset. This SKU is the M.2 1630 PCI-E card type. Ideal for low quantity
128預期29/4/2027
最少: 1
倍數: 1

SX-PCEAC2 2.4 GHz, 5 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 70 C MHF4 30 mm x 16.5 mm x 2.34 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多通訊協定模組 Wi-Fi+BLE Mod 2 ufl connect SamPck
173在途量
最少: 1
倍數: 1

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Murata Electronics 多通訊協定模組 Type 1LV Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
1,000預期9/6/2027
最少: 1
倍數: 1
: 1,000

1LV 2.4 GHz, 5 GHz 17 dBm SDIO, UART 1.62 V 1.98 V - 20 C + 70 C External 10 mm x 7.2 mm x 1.4 mm Bluetooth 5.0 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Murata Electronics 多通訊協定模組 RF TXRX MODULE 5.4/WIFI 6
1,000預期13/1/2027
最少: 1
倍數: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel 多通訊協定模組 GSM/GPRS/GNSS, Quad-band, Supports BT3.0 & BT4.0, Ultra-small, LCC form factor
250預期1/12/2026
最少: 1
倍數: 1
: 250

1.561 GHz, 1.575 GHz, 1.602 GHz 2 W Audio, Bluetooth, PCM, SD Card, UART 3.3 V 4.6 V - 35 C + 75 C 18.7 mm x 16 mm x 2.1 mm Bluetooth 3.0 GSM/GPRS GNSS Reel, Cut Tape
Quectel 多通訊協定模組 CAT 4
250在途量
最少: 1
倍數: 1
: 250

33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.8 V 3.8 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel, Cut Tape
Quectel 多通訊協定模組 Cat 4 + 3G + 2G module, mPCIe form factor, EMEA, Thailand
98在途量
最少: 1
倍數: 1

Tray
Quectel 多通訊協定模組 Global LTE Cat 1bis w/ GNSS
228預期15/10/2026
最少: 1
倍數: 1
: 250

ADC, I2C, PCM, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 26.5 mm x 22.5 mm x 2.4 mm LTE Cat 1 GNSS Reel, Cut Tape