多通訊協定模組

結果: 1,621
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 資格 封裝
u-blox 多通訊協定模組 M.2 card with JODY-W377, in tray
1,126在途量
最少: 1
倍數: 1
最大: 100

JODY-W3 2.4 GHz, 5 GHz 19 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.3 Tray
u-blox 多通訊協定模組 IW611, 802.11ax+BT, 1 PCB antenna or antenna pin
2,562在途量
最少: 1
倍數: 1
最大: 150
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
u-blox 多通訊協定模組 ESP32, 802.11bgn+BT, metal antenna, open CPU
2,197在途量
最少: 1
倍數: 1
: 500

NINA-W10 2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 10 mm x 14 mm x 3.8 mm Reel, Cut Tape
Sequans 多通訊協定模組 LTE CAT M1/NB2 LGA module with Global band support and GPS.
2,623在途量
最少: 1
倍數: 1
: 1,000

Reel, Cut Tape, MouseReel
STMicroelectronics 多通訊協定模組 Ultra-low-power dual core MCU 64 MHz Cortex-M0+ 32MHz 1 Mbyte Bluetooth LE
38,023在途量
最少: 1
倍數: 1
: 1,800

STM32WB 2.4 GHz 6 dBm I2C, USART, USB 1.7 V 3.6 V - 40 C + 85 C Chip 7.3 mm x 11 mm x 1.34 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel
Silicon Labs 多通訊協定模組 Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
2,080在途量
最少: 1
倍數: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
4,000預期22/1/2027
最少: 1
倍數: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape, MouseReel

Murata Electronics 多通訊協定模組 Type 1YN Shielded ultra-small dual bandWi-Fi 11a/b/g/n Bluetooth 5.2
5,992預期4/12/2026
最少: 1
倍數: 1
: 1,000

1YN 2.4 GHz 17 dBm SDIO, UART 1.71 V 3.63 V - 30 C + 70 C External 6.95 mm x 5.15 mm x 1.1 mm Bluetooth 5.2 802.11 b/g/n Reel, Cut Tape, MouseReel

Murata Electronics 多通訊協定模組 Type 2AE Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.0
3,988在途量
最少: 1
倍數: 1
: 1,000

2AE 2.4 GHz, 5 GHz 17 dBm SDIO, UART, USB 1.62 V 3.63 V - 40 C + 85 C External 8 mm x 7.8 mm x 1.15 mm Bluetooth 5.2 802.11 a/b/g/n/ac Reel, Cut Tape
Ezurio 多通訊協定模組 60 Series, Sterling Module w/u.FL, SDIO/UART
500在途量
最少: 1
倍數: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Telit Cinterion 多通訊協定模組
540在途量
最少: 1
倍數: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Digi 多通訊協定模組 Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, No SIM
2,650在途量
最少: 1
倍數: 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists 多通訊協定模組 1YN M.2 Wi-Fi 4 b/g/n, Bluetooth 5.2 with CYW43439 chipset and LBEE5KL1YN
700預期1/12/2026
最少: 1
倍數: 1

2.4 GHz 4-Wire UART, SDIO 3 V 3.5 V - 30 C + 85 C u.FL 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n Bulk
Embedded Artists 多通訊協定模組 2EL M.2 Wi-Fi 6 a/b/g/n/ac/ax, Bluetooth 5.3 with IW612 chipset and LBES5PL2EL
323預期26/2/2027
最少: 1
倍數: 1

2.4 GHz to 2.484 GHz 2.6 dBm SPI - 40 C + 85 C 802.11 a/b/g/n/ac/ax Bulk
Nordic Semiconductor 多通訊協定模組 Lower Power SIP for cellular IoT and DECT NR+
37,666在途量
最少: 1
倍數: 1
: 2,000

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Nordic Semiconductor 多通訊協定模組 Lower Power SIP for cellular IoT and DECT NR+
4,100在途量
最少: 1
倍數: 1
: 100

nRF91 23 dBm I2C, I2S, SPI, UART, USB 3 V 5.5 V - 40 C + 85 C Reel, Cut Tape
Nordic Semiconductor 多通訊協定模組 Low Power Cellular IoT SIP, LTE-M, NB-IoT, GNSS wireless modem
2,500預期25/12/2026
最少: 1
倍數: 1
: 2,500

700 MHz to 2.2 GHz 23 dBm I2C, I2S, SPI, UART 3 V 5.5 V - 40 C + 85 C 16 mm x 10.5 mm x 1.04 mm DECT NR+, LTE Cat-M1/NB1/NB2 GPS, QZSS Reel, Cut Tape
Fanstel 多通訊協定模組 Opensource remote USB dongle with BT840XE,ANT000, and an USB cable for remote mounting to avoid obstruction.
85預期13/10/2026
最少: 1
倍數: 1
: 32

Reel, Cut Tape
Espressif Systems 多通訊協定模組 ESP32-S31-WROOM-3 modules are powerful, generic Wi-Fi, Bluetooth 5.4 (LE), Bluetooth Classic and IEEE 802.15.4 MCUs that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Thi
2,280預期16/11/2026
最少: 1
倍數: 1

GPIO, SPI, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.4 IEEE 802.11ax
Seeed Studio 多通訊協定模組 Seeed Studio XIAO ESP32-C5
269在途量
最少: 1
倍數: 1

CEL 多通訊協定模組 WiFi bgn BT5 BT Mesh PCB Antenna BULK 20庫存量
最少: 1
倍數: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多通訊協定模組 WiFi bgn BT5 BT Mesh RF Connector BULK 20庫存量
最少: 1
倍數: 1

CMP4010 2.4 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3.3 V 3.3 V PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Mesh 802.11 b/g/n Bulk
CEL 多通訊協定模組 RTL8721, Dual Band, WiFi+BLE, MFH4, BULK 5庫存量
最少: 1
倍數: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多通訊協定模組 CMP4020-2 BULK 20庫存量
最少: 1
倍數: 1

CMP4020 2.4 GHz, 5 GHz 18 dBm GPIO, I2C, I2S, SDIO, SPI, UART, USB 3 V 3.6 V - 40 C + 85 C Bluetooth 5.1 Bulk
CEL 多通訊協定模組 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3庫存量
最少: 1
倍數: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk