多協議模組

結果: 1,626
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 資格 封裝
Texas Instruments 多協議模組 SimpleLink multipro tocol 2.4-GHz wirele
1,900預期21/1/2027
最少: 1
倍數: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Texas Instruments 多協議模組 SimpleLink multipro tocol 2.4-GHz wirele 前置作業時間 16 週
最少: 1
倍數: 1
: 2,000

CC2652RSIP 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External 7 mm x 7 mm BLE ISM Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,070預期4/9/2026
最少: 1
倍數: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs 多協議模組 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
1,300預期5/8/2026
最少: 1
倍數: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Silicon Labs 多協議模組 SiWN917Y NCP Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 4MB Flash in IC package?
200在途量
最少: 1
倍數: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Telit Cinterion 多協議模組
387預期10/8/2026
最少: 1
倍數: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm NBIoT, LTE GPS, GLONASS Tray
Embedded Artists 多協議模組 2GF M.2 Module
45預期30/10/2026
最少: 1
倍數: 1

2.4 GHz to 5 GHz 4-Wire UART, SDIO 3.15 V 3.46 V - 20 C + 70 C u.FL 802.11 a/b/g/n/ac Bulk
Intel BE200.NGWG.NVX
Intel 多協議模組 Intel Killer Wi-Fi 7 BE1750 x, 2230, 2x2 BE+BT, No vPro
100預期10/8/2026
最少: 1
倍數: 1

BE200
Insight SiP 多協議模組 nRF52832 LoRa Transceiver & BLE 5 Module AS
100在途量
最少: 1
倍數: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Intel 多協議模組 Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro
100預期3/8/2026
最少: 1
倍數: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
150預期6/8/2026
最少: 1
倍數: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
25預期6/8/2026
最少: 1
倍數: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, No Antenna, 32KHz XTAL Pins, MVP
50預期6/8/2026
最少: 1
倍數: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (SoC), Bluetooth LE, 672KB RAM, 8MB Flash, 2MB PSRAM, No Antenna, 32KHz XTAL Pins, MVP
50預期6/8/2026
最少: 1
倍數: 1

2.4 GHz I2C, SPI, QSPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm WiFi
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, Integrated Antenna, 32KHz XTAL Pins
100預期6/8/2026
最少: 1
倍數: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (NCP), Bluetooth LE, 672KB RAM, 4MB Flash, No Antenna, 32KHz XTAL Pins
50預期6/8/2026
最少: 1
倍數: 1

2.4 GHz SPI, UART 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, Integrated Antenna, 32KHz XTAL Pins
50預期6/8/2026
最少: 1
倍數: 1

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Silicon Labs 多協議模組 917 Wi-Fi 6 2.4 GHz Module (RCP), Bluetooth LE, 672KB RAM, 0MB Flash, No Antenna, 32KHz XTAL Pins
50預期6/8/2026
最少: 1
倍數: 1

2.4 GHz SDIO 3 V 3.63 V - 40 C + 85 C 21.1 mm x 16 mm x 2.3 mm Bluetooth WiFi
Seeed Studio 多協議模組 Wio Tracker L1 E-ink 前置作業時間 6 週
最少: 1
倍數: 1

Advantech 多協議模組 Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, LGA 1620 (Wi-Fi: PCIe/BT:USB)
7預期12/10/2026
最少: 1
倍數: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7
Embedded Artists 多協議模組 1XL M.2 Wi-Fi6 a/b/g/n/ac/ax MU-MIMO, Bluetooth 5.3 with 88W9098 and LBEE5ZZ1XL
3在途量
最少: 1
倍數: 1

2.4 GHz, 5 GHz UART, USB 3.14 V 3.46 V - 40 C + 85 C u.FL 22 mm x 30 mm x 1.5 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Bulk
Silicon Labs 多協議模組 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
836預期4/8/2026
最少: 1
倍數: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 3 V 3.63 V - 40 C + 85 C External 9.1 mm x 9.8 mm x 1.6 mm Bluetooth 5.0 Tray
u-blox M2-JODY-W683-00C
u-blox 多協議模組 M.2 card with JODY-W683, in tray
280預期12/2/2027
最少: 1
倍數: 1

Tray
u-blox 多協議模組 M.2 card with JODY-W377, single package
23預期4/8/2026
最少: 1
倍數: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Insight SiP 多協議模組 Global Coverage Ultra Wide Band & Bluetooth 5.1 LE Smart Module Module w/ Built in Antenna
50預期27/11/2026
最少: 1
倍數: 1