Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

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選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 產品 定位數 間距 排數 終端類型 裝配角 堆疊高度 额定电流 額定電壓 最高數據率 最低工作溫度 最高工作溫度 觸點电镀 觸點材料 外殼材料 系列 封裝
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 562庫存量
最少: 1
倍數: 1
: 500

Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape, MouseReel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 85庫存量
最少: 1
倍數: 1
: 500

Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 161工廠有庫存
最少: 1
倍數: 1
: 600

Headers 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 300庫存量
最少: 1
倍數: 1
: 175

Headers 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 837庫存量
最少: 1
倍數: 1
: 650

Sockets 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 87庫存量
最少: 1
倍數: 1
: 475

Headers 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm AcceleRate(R) HD High-Density 4-Row Terminal 715庫存量
最少: 1
倍數: 1
: 875

Plugs 200 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 350庫存量
最少: 1
倍數: 1
: 475

Headers 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 313庫存量
最少: 1
倍數: 1
: 475

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 91庫存量
最少: 1
倍數: 1
: 175

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape, MouseReel
Samtec 板對板及夾層連接器 0.635 mm AcceleRate(R) HD High-Density 4-Row Socket 2,565庫存量
最少: 1
倍數: 1
: 700

Sockets 120 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec 板對板及夾層連接器 .635MM ACCELERATE HD TERMINAL 3,797庫存量
最少: 1
倍數: 1
: 875

Plugs 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape, MouseReel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 28庫存量
最少: 1
倍數: 1
: 175

Headers 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm AcceleRate(R) HD High-Density 4-Row Terminal 188庫存量
最少: 1
倍數: 1
: 875

Plugs 40 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec 板對板及夾層連接器 0.635 mm AcceleRate(R) HD High-Density 4-Row Terminal 972庫存量
最少: 1
倍數: 1
: 875

Plugs 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape, MouseReel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket
649在途量
最少: 1
倍數: 1
: 650
Sockets 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel, Cut Tape, MouseReel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 無庫存前置作業時間 1 週
最少: 500
倍數: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 無庫存前置作業時間 1 週
最少: 650
倍數: 650
: 650
Sockets 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 無庫存前置作業時間 1 週
最少: 500
倍數: 500
: 500
Sockets 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 無庫存前置作業時間 3 週
最少: 500
倍數: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket 無庫存前置作業時間 1 週
最少: 500
倍數: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 無庫存前置作業時間 2 週
最少: 175
倍數: 175
: 175

Headers 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 無庫存前置作業時間 2 週
最少: 175
倍數: 175
: 175

Headers 80 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 無庫存前置作業時間 1 週
最少: 175
倍數: 175
: 175

Headers 240 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 10 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel
Samtec 板對板及夾層連接器 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Terminal 無庫存前置作業時間 8 週
最少: 475
倍數: 475
: 475

Headers 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 5 mm 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APM6 Reel