多通訊協定模組

結果: 1,632
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 資格 封裝
u-blox 多通訊協定模組 M.2 card with MAYA-W161, in tray 266庫存量
最少: 1
倍數: 1

MAYA-W1 2.4 GHz, 5 GHz 18 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 2.8 mm BLE, Bluetooth 5.2 802.11 a/b/g/n Tray

Silicon Labs 多通訊協定模組 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm 1,300庫存量
最少: 1
倍數: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
u-blox 多通訊協定模組 ESP32, 802.11bgn+BT, metal antenna, u-connectXpress 42庫存量
2,000預期14/9/2026
最少: 1
倍數: 1
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL Bluetooth 802.11 b/g/n Reel, Cut Tape
u-blox 多通訊協定模組 ESP32, 802.11bgn+BT, 8 MB flash, PCB ant., open CPU 307庫存量
2,000預期10/12/2026
最少: 1
倍數: 1
: 500

NINA-W10 2.4 GHz 18 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm BLE, Bluetooth 4.2 BR/EDR 802.11 b/g/n Reel, Cut Tape

Espressif Systems 多通訊協定模組 SMD module, ESP32-D0WD-V3, ESP32 ECO V3, 4 MB SPI flash, IPEX antenna connector, -40 C +105 C 1,674庫存量
7,150在途量
最少: 1
倍數: 1

2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 105 C External 18 mm x 19 mm x 3.2 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Intel 多通訊協定模組 Intel Wi-Fi 7 BE201, 2230, 2x2 BE+BT, No vPro 51庫存量
最少: 1
倍數: 1

BE201


Fanstel 多通訊協定模組 Compact nRF5340 BLE 5.4 module, dualcore MCU, 1280KB flash, 276KB RAM, pads for antenna 1,245庫存量
最少: 1
倍數: 1
: 1,000
2.4 GHz 3.6 dBm I2S, QSPI, SPI, UART 1.7 V 5.5 V - 40 C + 105 C External Antenna 8.4 mm x 9 mm x 1.6 mm Bluetooth 5.2 Reel, Cut Tape
Espressif Systems 多通訊協定模組 ESP32-WROVER-E integrates ESP32-D0WD-V3, with higher stability and safety performance. 70庫存量
2,600預期26/10/2026
最少: 1
倍數: 1

ESP32-WROVER-E 2.4 GHz 20 dBm ADC, DAC, GPIO, I2C, I2S, PWM, SD Card, SDIO, SPI, TWAI, UART 3 V 3.6 V - 40 C + 85 C PCB 18 mm x 31.4 mm x 3.3 mm Bluetooth 4.2
Ezurio 多通訊協定模組 BL654 - Bluetooth v5 / 802.15.4 / NFC Module (Nordic nRF52840) Integrated Antenna - Cut tape 135庫存量
500預期8/9/2026
最少: 1
倍數: 1

BL654 2.4 GHz 8 dBm GPIO, I2C, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C PCB 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
HMS Networks 多通訊協定模組 Anybus Wireless Bolt (Sunbolt) 3庫存量
最少: 1
倍數: 1

Anybus Wireless 2.4 GHz, 5 GHz 18 dBm Ethernet 19 V 36 V - 40 C + 65 C Integrated 68 mm x 75 mm Bluetooth 2.1, 4.0 802.11 a/b/g/n/d Bulk
Fanstel 多通訊協定模組 BLE 5.1 nRF52833 DF Long Range PCB Ant 601庫存量
最少: 1
倍數: 1
: 1,000

BM833 2.4 GHz 8 dBm I2C, I2S, SPI, UART 1.7 V 5.5 V - 40 C + 105 C PCB 10.2 mm x 20.6 mm x 1.9 mm Bluetooth 5.1 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silex Technology 多通訊協定模組 [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo 5庫存量
最少: 1
倍數: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
Intel AX211.NGWG.NV
Intel 多通訊協定模組 Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro 270庫存量
最少: 1
倍數: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax
Silicon Labs 多通訊協定模組 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault High, MVP(AI/ML), Certified 1,175庫存量
最少: 1
倍數: 1
: 1,000

MGM240L 2.4 GHz Reel, Cut Tape
Silicon Labs 多通訊協定模組 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 192kB RAM, Secure Vault Mid, Certified 990庫存量
最少: 1
倍數: 1
: 1,000

MGM240L 2.4 GHz Reel, Cut Tape
Espressif Systems 多通訊協定模組 SMD module, ESP32-PICO-V3 with 4MB flash die inside, ESP32 ECO V3, PCB antenna, for Alexa Connect Kit (ACK). 477庫存量
最少: 1
倍數: 1
: 650

ESP32 2.4 GHz 19.5 dBm GPIO, I2C, I2S, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 16 mm x 23 mm x 2.3 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
Embedded Artists 多通訊協定模組 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM 51庫存量
最少: 1
倍數: 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Telink 多通訊協定模組 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 3庫存量
最少: 1
倍數: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Intel 多通訊協定模組 Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro 97庫存量
最少: 1
倍數: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Ezurio 多通訊協定模組 BLE module BL653 (Nordic nRF52833) Trace pin (Tape/Reel) 807庫存量
最少: 1
倍數: 1
: 1,000

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Reel, Cut Tape
Ezurio 多通訊協定模組 Module, Sterling LWB5+, M.2, Key E, SDIO, UART 188庫存量
最少: 1
倍數: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Silicon Labs 多通訊協定模組 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 365庫存量
最少: 1
倍數: 1
: 1,000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Ezurio 多通訊協定模組 60 Series, Sterling Module w/u.FL, PCIE/UART 195庫存量
最少: 1
倍數: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Espressif Systems 多通訊協定模組 SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector 1,004庫存量
最少: 1
倍數: 1
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Tray
Microchip Technology 多通訊協定模組 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 809庫存量
最少: 1
倍數: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray