多通訊協定模組

 多通訊協定模組
多通訊協定模組,應有盡有。貿澤是眾多多通訊協定模組原廠授權代理商,提供多家業界頂尖製造商的多通訊協定模組產品,包括Espressif、Ezurio、Intel、Murata、Nordic Semiconductor、Silicon Labs、STMicroelectronics、u-blox等。
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想了解更多多通訊協定模組產品,請瀏覽下列產品分類。
結果: 1,621
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 資格 產品 封裝
Embedded Artists 多通訊協定模組 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM 51庫存量
最少: 1
倍數: 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac WiFi Modules Bulk
Silex Technology 多通訊協定模組 [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo 5庫存量
最少: 1
倍數: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm SDIO Modules Bulk
Silicon Labs 多通訊協定模組 Multiprotocol module, 2,4 GHz w/PCB antenna, +10 dBm, 1.5MB Flash, 256kB RAM, Secure Vault High, MVP(AI/ML), Certified 1,175庫存量
最少: 1
倍數: 1
: 1,000

MGM240L 2.4 GHz Reel, Cut Tape
Ezurio 多通訊協定模組 BLE module BL653 (Nordic nRF52833) Trace pin (Tape/Reel) 807庫存量
最少: 1
倍數: 1
: 1,000

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Bluetooth Modules Reel, Cut Tape
Ezurio 多通訊協定模組 Module, Sterling LWB5+, M.2, Key E, SDIO, UART 188庫存量
最少: 1
倍數: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Silicon Labs 多通訊協定模組 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 365庫存量
最少: 1
倍數: 1
: 1,000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules Reel, Cut Tape
Ezurio 多通訊協定模組 60 Series, Sterling Module w/u.FL, PCIE/UART 195庫存量
最少: 1
倍數: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Intel AX211.NGWG.NV
Intel 多通訊協定模組 Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro 269庫存量
最少: 1
倍數: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax WiFi Modules
Telink 多通訊協定模組 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 3庫存量
最少: 1
倍數: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Wireless Modules Reel
Intel 多通訊協定模組 Intel Wi-Fi 7 BE202, 2230, 2x2 BE+BT, No vPro 2庫存量
200在途量
最少: 1
倍數: 1

BE201 WiFi Modules
Intel 多通訊協定模組 Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro 97庫存量
最少: 1
倍數: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax WiFi Modules
Microchip Technology 多通訊協定模組 SMARTCONNECT WINC3400 WL MOD 767庫存量
最少: 1
倍數: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Pulse Electronics 多通訊協定模組 USB 802.11 b/g/n BT module 736庫存量
最少: 1
倍數: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Microchip Technology 多通訊協定模組 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 130庫存量
最少: 1
倍數: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silex Technology 多通訊協定模組 [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f 10庫存量
最少: 1
倍數: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm SDIO Modules Bulk
Silex Technology 多通訊協定模組 [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108. 15庫存量
最少: 1
倍數: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Wi-Fi Modules Cut Tape
NXP Semiconductors IW611UK/A1IZ
NXP Semiconductors 多通訊協定模組 IW611UK/A1I 25庫存量
最少: 1
倍數: 1
: 2,000

IW611HN Reel, Cut Tape
NXP Semiconductors IW612UK/A1IZ
NXP Semiconductors 多通訊協定模組 IW612UK/A1I 25庫存量
最少: 1
倍數: 1
: 2,000

IW612HN Reel, Cut Tape
Seeed Studio 多通訊協定模組 The factory is currently not accepting orders for this product. 187庫存量
最少: 1
倍數: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Silicon Labs 多通訊協定模組 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified. 99庫存量
最少: 1
倍數: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules Cut Tape
Silex Technology 多通訊協定模組 [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount 656庫存量
最少: 1
倍數: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Fortebit 多通訊協定模組 Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable, LiPo battery. 1庫存量
最少: 1
倍數: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
Crowd Supply 多通訊協定模組 SuperB (built-in trace) by Macchina 25庫存量
最少: 1
倍數: 1
2.4 GHz 18.5 dBm GPIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C Built-In 26.2 mm x 25.5 mm x 7.8 mm Bluetooth 802.11 b/g/n
Fortebit 多通訊協定模組 Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable. 5庫存量
最少: 1
倍數: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
DFRobot 多通訊協定模組 ESP32-C3-WROOM-02-N4 Module (PCB antenna) 26庫存量
最少: 1
倍數: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n