多通訊協定模組

 多通訊協定模組
多通訊協定模組,應有盡有。貿澤是眾多多通訊協定模組原廠授權代理商,提供多家業界頂尖製造商的多通訊協定模組產品,包括Espressif、Ezurio、Intel、Murata、Nordic Semiconductor、Silicon Labs、STMicroelectronics、u-blox等。
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想了解更多多通訊協定模組產品,請瀏覽下列產品分類。
結果: 1,621
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Silicon Labs 多通訊協定模組 802.11 b/g/n dual-band (2.4/5 GHz), dual-mode Bluetooth 5 Wi-Fi Modules
1,716在途量
最少: 1
倍數: 1

2.4 GHz, 5 GHz 18 dBm SDIO, UART, USB 1.85 V 3.3 V - 40 C + 85 C External 9.8 mm x 9.1 mm x 1.6 mm Bluetooth 5.0 802.11 a/b/g/n WiFi Modules Tray
u-blox 多通訊協定模組 M.2 card with JODY-W377, single package
49在途量
最少: 1
倍數: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Multiradio Modules Tray
Ezurio 多通訊協定模組 Module, Sterling LWB5+, M.2, Key E, USB, USB
200預期9/3/2027
最少: 1
倍數: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz USB 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Ezurio 多通訊協定模組 Sterling LWB+, MHF4, Tape and Reel
1,500預期2/10/2026
最少: 1
倍數: 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio 多通訊協定模組 Module, Sona MT320, MIMO, M.2 1420, RF Trace, Cut Tape
449預期9/3/2027
最少: 1
倍數: 1

2.4 GHz, 5 GHz - 40 C + 85 C 20 mm x 14 mm Wireless Modules Cut Tape
Ezurio 多通訊協定模組 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
250預期21/9/2026
最少: 1
倍數: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Wireless Module Cut Tape
Ezurio 多通訊協定模組 60 Series, Sterling Module w/u.FL, USB/UART
200預期1/3/2027
最少: 1
倍數: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Kaga FEI 多通訊協定模組 WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
300在途量
最少: 1
倍數: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray
Kaga FEI 多通訊協定模組 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
300預期17/11/2026
最少: 1
倍數: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray

Espressif Systems 多通訊協定模組 Highly-integrated, Small-sized Wi-fi + Bluetooth + Bluetooth Le Mcu Modules
1,943預期2/11/2026
最少: 1
倍數: 1
: 650

2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
Espressif Systems 多通訊協定模組 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, PCB antenna
1,802預期26/10/2026
最少: 1
倍數: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 85 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
GigaDevice 多通訊協定模組 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC
800在途量
最少: 1
倍數: 1
2.402 GHz to 2.48 GHz 23.4 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C 9.6 mm x 12.4 mm x 2.4 mm Bluetooth LE V5.2 IEEE 802.11 b/g/n/ax Wireless Module
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
800預期20/11/2026
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi Module
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
800預期1/1/2027
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
800預期1/1/2027
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
u-blox 多通訊協定模組 RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
495預期18/1/2027
最少: 1
倍數: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox 多通訊協定模組 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
250預期12/10/2026
最少: 1
倍數: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多通訊協定模組 Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
750預期31/12/2026
最少: 1
倍數: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多通訊協定模組 M.2 card with MAYA-W3 Wi-Fi 6E, Bluetooth module
140預期7/12/2026
最少: 1
倍數: 1

MAYA-W3 GPIO, I2C, SDIO, UART Evaluation Kits Tray
u-blox 多通訊協定模組 M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
140預期10/3/2027
最少: 1
倍數: 1

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Multiprotocol Modules Tray
u-blox 多通訊協定模組 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
958在途量
最少: 1
倍數: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Multiprotocol Modules Reel, Cut Tape, MouseReel
u-blox 多通訊協定模組
1,000預期4/2/2027
最少: 1
倍數: 1
: 500

MAYA-W3 UART 1.71 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm Bluetooth WiFi Multiprotocol Modules Reel, Cut Tape
u-blox 多通訊協定模組
1,000預期4/2/2027
最少: 1
倍數: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
u-blox 多通訊協定模組
1,000預期4/2/2027
最少: 1
倍數: 1
: 500

MAYA-W4 2.4 GHz to 5.89 GHz 18 dBm USB, UART 1.71 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Modules Reel, Cut Tape
u-blox 多通訊協定模組
1,000預期10/3/2027
最少: 1
倍數: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape