Tray 多通訊協定模組

結果: 162
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 產品 封裝
Microchip Technology 多通訊協定模組 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature 72庫存量
72預期24/9/2026
最少: 1
倍數: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Bluetooth and Zigbee Modules Tray
Microchip Technology 多通訊協定模組 ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 2,220庫存量
最少: 1
倍數: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
u-blox 多通訊協定模組 M.2 card with JODY-W263, in tray 195庫存量
最少: 1
倍數: 1

JODY-W2 2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.2 Tray
u-blox 多通訊協定模組 M.2 card with MAYA-W161, in tray 266庫存量
最少: 1
倍數: 1

MAYA-W1 2.4 GHz, 5 GHz 18 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 2.8 mm BLE, Bluetooth 5.2 802.11 a/b/g/n Tray

Silicon Labs 多通訊協定模組 Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm 1,300庫存量
最少: 1
倍數: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Inventek 多通訊協定模組 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE 213庫存量
最少: 1
倍數: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray

Espressif Systems 多通訊協定模組 SMD module, ESP32-D0WD-V3, ESP32 ECO V3, 4 MB SPI flash, IPEX antenna connector, -40 C +105 C 1,649庫存量
7,150在途量
最少: 1
倍數: 1

2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 105 C External 18 mm x 19 mm x 3.2 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Espressif Systems 多通訊協定模組 SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector 1,002庫存量
最少: 1
倍數: 1
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Tray
Microchip Technology 多通訊協定模組 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 809庫存量
最少: 1
倍數: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Ezurio 多通訊協定模組 Module, Sterling LWB5+, M.2, Key E, SDIO, UART 188庫存量
最少: 1
倍數: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Ezurio 多通訊協定模組 60 Series, Sterling Module w/u.FL, PCIE/UART 195庫存量
最少: 1
倍數: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Microchip Technology 多通訊協定模組 SMARTCONNECT WINC3400 WL MOD 767庫存量
最少: 1
倍數: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Pulse Electronics 多通訊協定模組 USB 802.11 b/g/n BT module 736庫存量
最少: 1
倍數: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Microchip Technology 多通訊協定模組 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna 130庫存量
最少: 1
倍數: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silicon Labs 多通訊協定模組 MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity 260庫存量
最少: 1
倍數: 1

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C RF 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Mesh SiP Modules Tray
InnoPhase IoT 多通訊協定模組 WiFi/BLE5/MCU Module w/ PCB Antenna 385庫存量
最少: 1
倍數: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C PCB 12.8 mm x 20 mm x 2.5 mm BLE 5.0 802.11 b/g/n 802.11 b/g/n, BLE 5.0 Tray
Telit Cinterion 多通訊協定模組 143庫存量
392在途量
最少: 1
倍數: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Multiprotocol Module Tray
Telit Cinterion 多通訊協定模組 392庫存量
最少: 1
倍數: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Multiprotocol Module Tray
Silicon Labs 多通訊協定模組 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 771庫存量
最少: 1
倍數: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Multiprotocol Module Tray
Microchip Technology 多通訊協定模組 ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna 65庫存量
最少: 1
倍數: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Quectel 多通訊協定模組 Cat 4 + 3G, 4Gbit ROM+2Gbit RAM, voice + data application, North America, mPCIe form factor 35庫存量
100在途量
最少: 1
倍數: 1

I2C, PCIe, PCM, UART, USB 2.0 3 V 3.6 V - 35 C + 75 C SMA 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS GNSS, LTE Cat 4 Tray
Telit Cinterion 多通訊協定模組 11庫存量
784在途量
最少: 1
倍數: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.6 V 4.5 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Cellular, NBIoT, LTE GPS Multiprotocol Module Tray
CEL 多通訊協定模組 WiFi+BLE, USB, Conn. 70庫存量
最少: 1
倍數: 1

CMP9377 2.4 GHz, 5 GHz 20 dBm USB 3.3 V 3.3 V - 40 C + 85 C External 17 mm x 12 mm x 3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
CEL 多通訊協定模組 88W9098 IC, WiFi6 2x2 + BT 5.1, M.2, 3x MHF4 Connectors 206庫存量
最少: 1
倍數: 1

2.4 GHz, 5 GHz 18 dBm PCIe, UART 3.14 V 3.46 V - 40 C + 85 C MHF4 30 mm x 28 mm x 3.65 mm Bluetooth 5.2 Tray
InnoPhase IoT 多通訊協定模組 WiFi/BLE5/MCU Module w/ Ceramic Chip Antenna Reduced Footprint 154庫存量
最少: 1
倍數: 1

2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C u.FL 12.8 mm x 20 mm x 2.5 mm BLE 5.0 802.11 b/g/n 802.11 b/g/n, BLE 5.0 Tray