新型藍芽模組-802.15.1
Silicon Labs BGM270S 802.15.4 Wireless Modules are secure, high-performance wireless BLUETOOTH® LE modules based on the Series 2 EFR32BG27 SoC, delivering exceptional RF performance and energy efficiency. It is optimized for the needs of battery and line-powered Internet of Things (IoT) devices operating in the 2.4GHz band.
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Silicon Labs BGM270S 802.15.4 Wireless ModulesSecure, high-performance wireless BLUETOOTH® LE modules based on the Series 2 EFR32BG27 SoC.3/2/2026
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Fanstel Compact BC15 BLUETOOTH® 6.0 ModulesRobust, highly flexible, ultra-low-power BLE devices utilizing a Nordic nRF54L15 SoC.5/12/2025 -
Panasonic PAN B611-1 BLUETOOTH® 6.0 Low Energy (LE) ModulesBased on Nordic nRF54L15, offering ideal performance & memory while minimizing current consumption.6/11/2025 -
Digi XBee® 3 BLU 模組An easy-to-use solution for designers supporting BLE 5.4 for industrial wireless IoT connectivity.8/8/2025 -
Panasonic PAN1783/A BLUETOOTH® 5.4 LE音訊無線模組Advanced wireless solutions based on the Nordic nRF5340 single-chip controller.6/5/2025 -
Fanstel BM15x Nordic nRF54 Based ModulesRobust, highly flexible, ultra-low-power BLE modules utilizing Nordic nRF54L15 or nRF54L05 SoCs.17/2/2025 -
u-blox NORA-B2獨立BLUETOOTH® 6 LE模組Based on the nRF54 SoCs from Nordic Semiconductor and ideal for IoT applications.9/11/2024 -
Quectel HCM511S High-Performance BLUETOOTH® 5.4 ModulesFeatures an Arm® Cortex®-M33 processor running up to 76.8MHz and supports BLE 5.4.10/9/2024 -
Quectel HCM511S-TE-B BLUETOOTH® Development BoardDesigned for testing and developing the HCM511S module.10/9/2024 -
Microchip Technology RNBD350 BLUETOOTH®低功耗模組此模組為實現BLUETOOTH® 5.2低功耗連接提供了完整的解決方案。28/6/2024 -
Murata BLUETOOTH® ModulesOffer solutions that enable direct, low-power connections with smartphones, tablets, and laptops.19/3/2024 -
Silicon Labs xGM260P無線模組Deliver excellent RF performance and are optimized for battery-powered IoT devices.26/2/2024 -
u-blox ANNA-B112 Stand-alone BLUETOOTH® 5 ModulesUltra-compact SiPs featuring Bluetooth 5 and an Arm® Cortex®-M4 microprocessor with FPU.12/2/2024 -
Infineon Technologies CYW20822 BLUETOOTH® LE ModulesFully integrated BLUETOOTH® LE wireless modules pre-loaded with EZ-Serial firmware.2/2/2024 -
Renesas Electronics DA14535MOD SmartBond TINY BLUETOOTH® LE ModulesFeature up to +3dBm transmit Pout, 64KB RAM, 160KB ROM, and 12KB OTP.2/1/2024 -
Ezurio Sera NX040 Ultra-Wide Band & BLUETOOTH® LE ModulesOptimized for low-power operation and reduces the need for external clocks, filters, and components.22/12/2023 -
Globalscale Technologies GTI-ATM3330e Extreme Low Power BLUETOOTH® 5.3 SoCA low-power solution from the Wireless SoC Series.12/12/2023 -
Renesas Electronics DA14592MOD Bluetooth® Low-Energy (BLE) ModulesInclude all external components required to implement a BLE solution and feature a quad-decoder.6/12/2023 -
Renesas Electronics DA14592 SmartBond™ BLE 5.2 SoC內嵌快閃記憶體64MHz的CM33F應用內核，64MHz的CM0+配置MAC。6/12/2023 -
Renesas Electronics DA14592 Development ToolsOffer comprehensive and user-friendly development environment with real-time power profiling.6/12/2023 -
Renesas Electronics DA14592MOD Development ToolsOffer real-time profiling and user-friendly development environment.28/11/2023 -
Ezurio Vela IF820 BLUETOOTH® 5x Dual-Mode ModulesAllow a single module to cover Classic BLUETOOTH® and migration to Bluetooth with a single part.31/10/2023 -
u-blox NINA-B50 Bluetooth® ModulesStand-alone Bluetooth® 5.3 Low-Energy (LE) modules based on the NXP K32W1480 chip.19/10/2023 -
Murata 2EG BLUETOOTH® 5.2 Wireless ModuleUltra-small and designed for connected IoT edge devices in industrial and medical applications.8/9/2023 -
Renesas Electronics DA14695MOD多核心Bluetooth® 5.2模組基於SmartBond DA14695MOD BLUETOOTH® 低功耗5.2片上系統（SoC）。10/8/2023