FF3MR20W3M1HH11BPSA1

Infineon Technologies
726-FF3MR20W3M1HH11B
FF3MR20W3M1HH11BPSA1

製造商:

說明:
離散半導體模組 EasyPACK module with CoolSiC Trench MOSFET and High Current Pin / NTC

壽命週期:
新產品:
該製造商的新產品。
ECAD模型:
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庫存量: 13

庫存:
13
可立即送貨
在途量:
8
工廠前置作業時間:
10
工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:
此產品免費航運

Pricing (HKD)

數量 單價
總價
HK$4,199.10 HK$4,199.10
HK$3,738.46 HK$29,907.68

商品屬性 屬性值 選擇屬性
Infineon
產品類型: 離散半導體模組
RoHS:  
EasyPACK Modules
SiC
4.4 V
- 10 V, + 23 V
Press Fit
- 40 C
+ 175 C
EasyPACK
Tray
品牌: Infineon Technologies
組裝國家: Not Available
擴散國: Not Available
原產國: AT
下降時間: 67 ns
Id - C連續漏極電流: 275 A
Pd - 功率消耗 : 20 mW
產品類型: Discrete Semiconductor Modules
Rds On - 漏-源電阻: 4.1 mOhms
上升時間: 44 ns
原廠包裝數量: 8
子類別: Discrete and Power Modules
公司名稱: CoolSiC
晶體管極性: N-Channel
標準斷開延遲時間: 142 ns
標準開啟延遲時間: 86 ns
Vds - 漏-源擊穿電壓: 2 kV
Vgs th - 門源門限電壓 : 5.15 V
零件號別名: FF3MR20W3M1H_H11 SP006049702
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所選屬性: 0

CNHTS:
8504409100
CAHTS:
8541210000
USHTS:
8541210095
JPHTS:
854121000
TARIC:
8541210000
MXHTS:
8541210100
ECCN:
EAR99

EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.