BL54H20 Series Multi-Core BLE Modules

Ezurio BL54H20 Series Multi-Core BLE Modules integrate BLUETOOTH® LE 5.4, 802.15.4 protocols (Thread, Matter), and NFC, delivering high-performance wireless connectivity. These modules are powered by the Nordic nRF54H20 System on Chip (SoC). This SoC features dual Arm® Cortex®-M33 processors, RISC-V co-processors, 2MB flash, and 1MB RAM. The BL54H20 BLE modules incorporate a compact form factor (13.5mm x 10mm x 1.8mm), robust security (PSA Certified Level 3), and an industrial operating range of -40°C to 105°C. The BL54H20 Series multi-core BLE modules support secure boot, secure firmware update, secure storage, and integrated tamper sensors for physical security. These modules facilitate advanced use cases like asset tracking, secure medical peripherals, industrial automation, IoT, and smart devices. 

結果: 4
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - WiFi (802.11) 封裝
Ezurio 多協議模組 Module, BL54H20, Bluetooth LE, Chip Antenna, Tape and Reel
985預期21/7/2026
最少: 1
倍數: 1
: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio 多協議模組 Module, BL54H20, Bluetooth LE, MHF4, Tape and Reel
986預期21/7/2026
最少: 1
倍數: 1
: 1,000

BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Reel, Cut Tape
Ezurio 多協議模組 Module, BL54H20, Bluetooth LE, Chip Antenna, Cut Tape 無庫存前置作業時間 16 週
最少: 1
倍數: 1
BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C Chip 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Cut Tape
Ezurio 多協議模組 Module, BL54H20, Bluetooth LE, MHF4, Cut Tape 無庫存前置作業時間 16 週
最少: 1
倍數: 1
BL54H20 UART 1.71 V 1.98 V - 40 C + 105 C MHF4 13.5 mm x 10 mm x 1.8 mm Bluetooth 5.4 802.15.4 Cut Tape