所有結果 (1,139)

選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS
congatec 開發板及套件 - 其他處理器 COM-HPC Client 3.5 carrier board suitable for congatec COM-HPC modules with Size M (Mini).
7在途量
最少: 1
倍數: 1


JUMPtec 電腦模組 - COM JUMPtec HSP COMe-cTL6 Cu-core threaded
2在途量
最少: 1
倍數: 1

JUMPtec 電腦模組 - COM JUMPtec SMARC-sAMX6i 4x0.8 1/4GB
2預期25/2/2027
最少: 1
倍數: 1

congatec CPU和晶片散熱器 Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
10在途量
最少: 1
倍數: 1


congatec 矩形電纜組件 Cable for Backlight with JST ZHR-8 connector, 50cm, Open End, matches with conga-JC370.
5預期23/7/2026
最少: 1
倍數: 1
congatec 電腦模組 - COM COM Express Type 6 Compact module based on Intel Core i7-1365UE
1預期8/7/2026
最少: 1
倍數: 1

JUMPtec 電腦模組 - COM JUMPtec COMe-mBTi10 E3827 1E/4S
4預期3/3/2027
最少: 1
倍數: 1

congatec conga-TCR8/8845HS
congatec 電腦模組 - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded 8845HS with 8 cores 3.8GHz up to 5.1GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial temp
2預期22/1/2027
最少: 1
倍數: 1

congatec conga-TEVAL3/COMe 3.1
congatec 開發板及套件 - 其他處理器 congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40 C to 85 C
5預期21/7/2026
最少: 1
倍數: 1

JUMPtec 散熱器 HSP COMe-mAL10 E2 through
4預期9/11/2026
最少: 1
倍數: 1

congatec 電腦模組 - COM Qseven 2.0 module based on Intel Atom x5 E3940 SoC (Itemp Quad-core, 9.5W TDP, CPU freq. 1.6/1.8GHz, GPU 12EU freq. 400/600MHz) with on-board memory 4GB DDR3L-1866 and 16GB eMMC. 無庫存前置作業時間 27 週
最少: 1
倍數: 1

congatec 模組配件 The conga-DP/HDMI adapter 4k is used for evlauation of the DP/HDMI graphics interface of x86 Qseven and COM Express modules in combination with the congatec evaluation carrier boards conga-QEVAL and conga-TEVAL. It supports full 4k display resolution
3在途量
最少: 1
倍數: 1
congatec 電腦模組 - COM COM Express Type 6 Compact module based on Intel Core i3-1320PRE
1預期3/11/2026
最少: 1
倍數: 1


congatec 插座及轉接器 USB 2.0 to Serial Adapter DSUB9 based on FTDI FT232
5在途量
最少: 1
倍數: 1

congatec conga-QA3/i-E3815-2G eMMC4
congatec 電腦模組 - COM QSEVEN INTEL ATOM E3815 BAY TRAIL
21預期29/6/2026
最少: 1
倍數: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU和晶片散熱器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
1預期21/7/2026
最少: 1
倍數: 1

congatec conga-HPC/mRLP-HSP-B
congatec 散熱器 Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
2預期8/7/2026
最少: 1
倍數: 1

congatec CONGA-HPC/EVAL-MINI
congatec congatec Evaluation Carrier Board for COM-HPC Mini modules.
2預期16/7/2026
最少: 1
倍數: 1
congatec conga-TC675/CSP-HP-T
congatec congatec Standard passive cooling solution for high performance COM Express module conga-TC675 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.
1預期17/11/2026
最少: 1
倍數: 1
JUMPtec 電腦模組 - COM COMe-mRP10 i5-1345UE 16GB 9工廠有庫存
最少: 1
倍數: 1

JUMPtec 電腦模組 - COM JUMPtec COMe-cAL6 N3350 無庫存前置作業時間 6 週
最少: 1
倍數: 1

JUMPtec 開發板及套件 - x86 SMARC Evaluation Carrier 2.1 無庫存前置作業時間 5 週
最少: 1
倍數: 1

congatec 散熱器 Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded. 無庫存前置作業時間 3 週
最少: 1
倍數: 1

congatec 散熱器 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded. 無庫存前置作業時間 12 週
最少: 1
倍數: 1
congatec 電腦模組 - COM Qseven module with ultra low power Freescale ARM Cortex A9 dual core 800MHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Lidded FCBGA package. Industrial grade temperature range from -40 C to 85 C. 無庫存前置作業時間 3 週
最少: 1
倍數: 1