所有結果 (1,059)

選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS
JUMPtec 電腦模組 - COM JUMPtec COMe-mAL10 E2 E3930 4E
183在途量
最少: 1
倍數: 1

JUMPtec 電腦模組 - COM JUMPtec COMe-mAL10 E2 E3950 8E
27預期6/4/2026
最少: 1
倍數: 1

congatec 開發板及套件 - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1
41在途量
最少: 1
倍數: 1

congatec 電腦模組 - COM COM Express Mini Type10 module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz 2MB L2 cache 8GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.
28預期21/9/2026
最少: 1
倍數: 1

JUMPtec 電腦模組 - COM COMe-mRP10 E2 i7-1365URE 32GB
4預期4/3/2026
最少: 1
倍數: 1

congatec 電腦模組 - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.
37在途量
最少: 1
倍數: 1

JUMPtec 散熱器 HSP COMe-mAL10 E2 thread 前置作業時間 26 週
最少: 1
倍數: 1

JUMPtec 電腦模組 - COM JUMPtec COMe-mEL10 E2 x6212RE 4G/16G
19在途量
最少: 1
倍數: 1

congatec 電腦模組 - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.
22在途量
最少: 1
倍數: 1

congatec 開發板及套件 - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
26在途量
最少: 1
倍數: 1

congatec 電腦模組 - COM SMARC 2.0 module with Intel Atom x7-E3930 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache, 8GB 2400MT/s LPDDR4 onboard memory and 32GB eMMC onboard flash. Industrial temperature range -40 C to 85 C.
18預期20/4/2026
最少: 1
倍數: 1
congatec 電腦模組 - COM SMARC 2.1 module with Intel Atom x6413E quad core processor with 1.5GHz core frequency up to 3.0GHz, 1.5MB cache, 8GB 3200MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash.
8預期21/7/2026
最少: 1
倍數: 1

congatec 開發板及套件 - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0
4預期3/8/2026
最少: 1
倍數: 1

JUMPtec 電腦模組 - COM JUMPtec COMe Mount Kit 8mm 1set
2預期9/3/2026
最少: 1
倍數: 1

congatec CPU和晶片散熱器 *Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded 2庫存量
最少: 1
倍數: 1
congatec CPU和晶片散熱器 * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
4預期20/2/2026
最少: 1
倍數: 1

congatec 電腦模組 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.
2在途量
最少: 1
倍數: 1

congatec 開發板及套件 - x86 Evaluation carrier board for COM HPC Client.
1預期16/3/2026
最少: 1
倍數: 1

congatec conga-QA3/i-E3815-2G eMMC4
congatec 電腦模組 - COM QSEVEN INTEL ATOM E3815 BAY TRAIL
17預期21/5/2026
最少: 1
倍數: 1

congatec conga-TC370/i3-8145UE
congatec 電腦模組 - COM COM Express Type 6 Compact module based on Intel Core i3-8145UE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 4MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).
2預期21/7/2026
最少: 1
倍數: 1



JUMPtec 電腦模組 - COM JUMPtec COMe mini Active Uni Cooler (w/o HSP)
35在途量
最少: 1
倍數: 1

JUMPtec CPU和晶片散熱器 HSP COMe-cAP6 Cu-core threaded
1在途量
最少: 1
倍數: 1

congatec 電腦模組 - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.
5在途量
最少: 1
倍數: 1

congatec 開發板及套件 - 其他處理器 COM-HPC Client 3.5 carrier board suitable for congatec COM-HPC modules with Size M (Mini).
3預期18/5/2026
最少: 1
倍數: 1


congatec HDMI線纜
20在途量
最少: 1
倍數: 1