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ASP-222919-01

Name: Samtec ASP-222919-01
Brand: Samtec
SKU: 200-ASP-222919-01
Price: 33.13 HKD
Availability: InStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-ASP-222919-01

製造商編號：

ASP-222919-01

製造商：

Samtec

說明：

板對板及夾層連接器 MOD. JSOM ASSY 10MM STACK - COM HPC

壽命週期:

工廠指定訂單:

獲取報價以驗證製造商的當前價格、前置時間和訂購要求。

規格書:

ASP-222919-01 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

更多資訊

瞭解更多關於Samtec ASP-222919-01的資訊

庫存量: 980

庫存：: 980 可立即送貨

發生意外錯誤了。請稍後再試。

數量超過980會受到最小訂單要求的限制。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

Pricing (HKD)

數量	單價	總價
	HK$33.13	HK$33.13
	HK$27.62	HK$276.20
	HK$26.39	HK$2,639.00
	HK$24.74	HK$6,185.00
	HK$23.67	HK$11,835.00
1,000	報價

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商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	板對板及夾層連接器
RoHS:
產品:	Accessories
堆疊高度:	10 mm
附件類型:	Standoff
品牌:	Samtec
產品類型:	Board to Board & Mezzanine Connectors
子類別:	Board to Board & Mezzanine Connectors
公司名稱:	COM-HPC

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所選屬性: 0

篩選文檔:

CAHTS:: 7318190000
USHTS:: 7318190000
KRHTS:: 7318190000
BRHTS:: 73181900
ECCN:: EAR99

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

COM-HPC™ Interconnect Solutions

Samtec COM-HPC™ Interconnect Solutions offer up to 300W power rating, 400 total pins, and up to 32Gbps per channel. COM-HPC solutions provide ultra-high-speed performance and extended connectivity with limitless scalability, ensuring to meet the growing demands. These high-density interconnecting systems meet the COM-HPC standard for high-performance Computer-on-Modules. Samtec COM-HPC Interconnect Solutions are ideal for medical imaging, embedded edge servers, 5G connected vehicles, 5G wireless infrastructure, and industrial applications.