CA 多通訊協定模組

結果: 1,632
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 資格 產品 封裝
CEL 多通訊協定模組 ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3庫存量
最少: 1
倍數: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
CEL 多通訊協定模組 Wi-Fi 6 BT/BLE5.2 SDIO I-Temp PCB Antenna 39庫存量
最少: 1
倍數: 1

CMP961X 2.4 GHz, 5 GHz SPI, UART Bluetooth Bulk
u-blox 多通訊協定模組 M.2 card with JODY-W377, single package
49在途量
最少: 1
倍數: 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Multiradio Modules Tray
Ezurio 多通訊協定模組 Module, Sterling LWB5+, MHF4
700預期18/9/2026
最少: 1
倍數: 1
: 1,000

Sterling-LWB5+ 2.4 GHz, 5 GHz UART, USB 3.3 V 3.3 V - 40 C + 85 C 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Reel, Cut Tape, MouseReel
Ezurio 多通訊協定模組 Sterling LWB+, MHF4, Tape and Reel
1,500預期2/10/2026
最少: 1
倍數: 1
: 800

Sterling-LWB+ 2.4 GHz SDIO, UART 3.3 V 3.3 V - 40 C + 85 C 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Reel, Cut Tape
Ezurio 多通訊協定模組 Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
1,000預期31/12/2026
最少: 1
倍數: 1
: 1,000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Multiprotocol Modules Reel, Cut Tape
Ezurio 多通訊協定模組 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
250預期26/10/2026
最少: 1
倍數: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Wireless Module Cut Tape
Ezurio 多通訊協定模組 60 Series, Sterling Module w/u.FL, USB/UART
200預期1/3/2027
最少: 1
倍數: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Kaga FEI 多通訊協定模組 WLAN module for NXP IW611. WiFi 6 1x1 dual band, BT, BLE 5.4
300預期14/9/2026
最少: 1
倍數: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray
Kaga FEI 多通訊協定模組 WLAN + ARM M33 MCU module for NXP RW612. WiFi 6 1x1 dual band, BT, BLE 5.4.
300預期17/11/2026
最少: 1
倍數: 1

SDIO, UART 1.71 V 2.46 V - 40 C + 85 C 25 mm x 15.7 mm x 2.1 mm Bluetooth WiFi Multiprotocol Modules Tray
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC / onboard PCB antenna
800預期20/11/2026
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 105 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi Module
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
800預期1/1/2027
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
GigaDevice 多通訊協定模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
800預期1/1/2027
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
u-blox 多通訊協定模組 RW612, 802.11ax+BLE+802.15.4, ant pin, open CPU, 16MB
495預期18/1/2027
最少: 1
倍數: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Antenna Pin Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
u-blox 多通訊協定模組 Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
250預期12/10/2026
最少: 1
倍數: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多通訊協定模組 Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
750預期31/12/2026
最少: 1
倍數: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Multiprotocol Modules Reel, Cut Tape
u-blox 多通訊協定模組 M.2 card with MAYA-W3 Wi-Fi 6E, Bluetooth module
140預期7/12/2026
最少: 1
倍數: 1

MAYA-W3 GPIO, I2C, SDIO, UART Evaluation Kits Tray
u-blox 多通訊協定模組 M.2 Type 2230 Key E card with MAYA-W472 Wi-Fi 6 Dual-Band, Bluetooth 5.4, 802.15.4 module
140預期1/2/2027
最少: 1
倍數: 1

MAYA-W4 2.405 GHz to 2.48 GHz 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Multiprotocol Modules Tray
u-blox 多通訊協定模組 IW612, 802.11ax+BT+802.15.4, 1 PCB antenna or ant. pin
958在途量
最少: 1
倍數: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C PCB Antenna 14.3 mm x 10.4 mm x 1.9 mm Multiprotocol Modules Reel, Cut Tape, MouseReel
u-blox 多通訊協定模組
1,000預期4/2/2027
最少: 1
倍數: 1
: 500

MAYA-W3 UART 1.71 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm Bluetooth WiFi Multiprotocol Modules Reel, Cut Tape
u-blox 多通訊協定模組
1,000預期4/2/2027
最少: 1
倍數: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
u-blox 多通訊協定模組
1,000預期4/2/2027
最少: 1
倍數: 1
: 500

MAYA-W4 2.4 GHz to 5.89 GHz 18 dBm USB, UART 1.71 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Modules Reel, Cut Tape
u-blox 多通訊協定模組
1,000預期10/3/2027
最少: 1
倍數: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 18 dBm SPI, UART 3.13 V 3.46 V - 40 C + 85 C U.FL 14.3 mm x 10.4 mm x 1.9 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape
u-blox 多通訊協定模組 Host-based dual-band Wi-Fi 6 and Bluetooth LE module for IoT, 1 antenna pin
500預期31/12/2026
最少: 1
倍數: 1
: 500

MAYA-W4 2.4 GHz, 5 GHz 15 dBm, 18 dBm SPI, UART, USB 3.13 VDC 3.46 VDC - 40 C + 85 C Pin 14.3 mm x 10.4 mm x 1.9 mm Bluetooth and Wi-Fi Modules Reel, Cut Tape
u-blox 多通訊協定模組 Wi-Fi 6 Dual-Band, BLE 5.4, 802.15.4, host-based module, 2 ant pins
1,000預期1/2/2027
最少: 1
倍數: 1
: 500

MAYA-W4 2 dB SPI, UART 1.71 V 3.46 V - 40 C + 85 C 14.3 mm x 10.4 mm x 2 mm Bluetooth WiFi Multiradio Modules Reel, Cut Tape