FGA66XABMD

Name: Quectel FGA66XABMD
Brand: Quectel
SKU: 277-FGA66XABMD
Price: 117.96 HKD
Availability: OutOfStock

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請參閱產品規格

Mouser 編號：

277-FGA66XABMD

製造商編號：

FGA66XABMD

製造商：

Quectel

說明：

多協議模組 Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C

壽命週期:

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規格書:

FGA66XABMD 規格書

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商品屬性	屬性值	選擇屬性
製造商:	Quectel
產品類型:	多協議模組
頻率:	2.4 GHz, 5 GHz
接口類型:	SPI, UART, USB
電源電壓 - 最小值:	3.14 V
電源電壓 - 最大值:	3.46 V
最低工作溫度:	- 40 C
最高工作溫度:	+ 85 C
天線連接器類型:	PCB Antenna
尺寸:	23 mm x 14 mm x 2.2 mm
協議 - 藍牙、BLE (802.15.1):	BLE 5.4
協議 - WiFi (802.11):	802.11 a/b/g/n/ac/ax
封裝:	Reel
封裝:	Cut Tape
品牌:	Quectel
數據率:	114.7 Mb/s
調製技術:	DSSS/ OFDM/ DBPSK/ DQPSK/ CCK/ BPSK/ QPSK/ 16QAM/ 64QAM/ 256QAM
安裝風格:	SMD/SMT
工作電源電壓:	3.3 V
產品類型:	Multiprotocol Modules
原廠包裝數量:	500
子類別:	Wireless & RF Modules
類型:	Wi-Fi 6, BLE 5.4

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篩選文檔:

規格書

FGA66XABMD 規格書

原產地分類

原產國:: 中國
封裝原產國:: 無資料
擴散國:: 無資料

出貨時，國家可能會有所變更。

FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

Quectel FGA66X Wi-Fi^® 6, BLE 5.4, and IEEE 802.15.4 Modules are high-performance modules in an LGA package and support the IEEE 802.11ax standard protocol. These modules operate at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X modules are designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the modules to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X modules are available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. These modules operate over a wide temperature range of -40°C to +85°C. The FGA66X modules are ideal for a variety of smart home and industrial applications.