|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-1-K-TR
- Samtec
-
400:
HK$83.76
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAM10010S061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
最少: 400
倍數: 400
:
400
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-2-K-TR
- Samtec
-
1:
HK$113.11
-
無庫存前置作業時間 6 週
|
Mouser 元件編號
200-LPAM10010S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 6 週
|
|
最少: 1
倍數: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-04-2-K-TR
- Samtec
-
575:
HK$48.66
-
無庫存前置作業時間 12 週
|
Mouser 元件編號
200-LPAM10015L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 12 週
|
|
最少: 575
倍數: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-L-06-2-K-TR
- Samtec
-
375:
HK$74.88
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM10015L062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 375
倍數: 375
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-04-2-K-TR
- Samtec
-
575:
HK$65.18
-
無庫存前置作業時間 12 週
|
Mouser 元件編號
200-LPAM10015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 12 週
|
|
最少: 575
倍數: 575
:
575
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.5-S-06-2-K-TR
- Samtec
-
1:
HK$115.33
-
無庫存前置作業時間 5 週
|
Mouser 元件編號
200-LPAM10015S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 5 週
|
|
最少: 1
倍數: 1
:
375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-1-K-TR
- Samtec
-
325:
HK$93.54
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM20010L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
最少: 325
倍數: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
1:
HK$169.74
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM20010L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
最少: 1
倍數: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
300:
HK$111.71
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAM20015L082KTR
|
Samtec
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
|
|
無庫存前置作業時間 3 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-1-K-TR
- Samtec
-
450:
HK$86.97
-
無庫存前置作業時間 5 週
|
Mouser 元件編號
200-LPAM20015S041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 5 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-04-2-K-TR
- Samtec
-
450:
HK$78.58
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM20015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-1-K-TR
- Samtec
-
300:
HK$107.27
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM20015S061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-06-2-K-TR
- Samtec
-
300:
HK$106.04
-
無庫存前置作業時間 11 週
|
Mouser 元件編號
200-LPAM20015S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 11 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-1-K-TR
- Samtec
-
1:
HK$192.27
-
無庫存前置作業時間 5 週
|
Mouser 元件編號
200-LPAM20015S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 5 週
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-2-K-TR
- Samtec
-
1:
HK$181.66
-
無庫存前置作業時間 3 週
|
Mouser 元件編號
200-LPAM20015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 3 週
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-06-2-K-TR
- Samtec
-
325:
HK$123.63
-
無庫存前置作業時間 2 週
|
Mouser 元件編號
200-LPAM30010S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 2 週
|
|
最少: 325
倍數: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-08-1-K-TR
- Samtec
-
1:
HK$224.41
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30010S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
最少: 1
倍數: 1
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-1-K-TR
- Samtec
-
450:
HK$92.97
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM30015L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-2-K-TR
- Samtec
-
1:
HK$206.16
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30015L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
最少: 1
倍數: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-04-2-K-TR
- Samtec
-
450:
HK$100.78
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM30015S042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 450
倍數: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-06-2-K-TR
- Samtec
-
300:
HK$124.12
-
無庫存前置作業時間 12 週
|
Mouser 元件編號
200-LPAM30015S062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 12 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-1-K-TR
- Samtec
-
300:
HK$160.87
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30015S081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-2-K-TR
- Samtec
-
300:
HK$160.87
-
無庫存前置作業時間 10 週
|
Mouser 元件編號
200-LPAM30015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 10 週
|
|
最少: 300
倍數: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-40-01.0-L-04-2-K-TR
- Samtec
-
475:
HK$112.78
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40010L042KTR
|
Samtec
|
板對板及夾層連接器 1.27MM LP ARRAY HS HD LOW PRO
|
|
無庫存前置作業時間 4 週
|
|
最少: 475
倍數: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-1-K-TR
- Samtec
-
325:
HK$133.90
-
無庫存前置作業時間 4 週
|
Mouser 元件編號
200-LPAM40010L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
無庫存前置作業時間 4 週
|
|
最少: 325
倍數: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel
|
|