THERM-A-GAP® Conductive, Cure-In-Place Compound

Parker Chomerics THERM-A-GAP® Conductive, Cure-in-Place (CIP) Compounds are two-component compounds that conform to irregular shapes and are vibration-dampening. No pre-mixing or weighing of components is required when using CIP 35 and CIP 60 compounds. The CIP 35 series features dispensable cure-in-place gap filling, potting, sealing, and encapsulating with a 55 Shore A hardness. The CIP 60 compound offers excellent thermal performance with 6.0W/m-K typical thermal conductivity and 50 Shore 00 hardness at full cure. Parker Chomerics THERM-A-GAP Conductive CIP Compounds are ideal for automotive, energy storage, power electronics, and telecommunications infrastructure applications.

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Parker Chomerics 熱介面產品 Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 45CC Kit
規格書
7庫存量
HK$568.00
HK$510.79
HK$492.87
HK$483.50
檢視
最少： 1
倍數： 1
Gap Fillers / Gap Pads / Sheets Silicone Compound, 2 Part 2.5W/m-K Green - 55 C + 200 C UL 94 V-0 CIP35
Parker Chomerics 熱介面產品 Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 200CC Kit
規格書
12在途量
HK$1,537.14
HK$1,406.61
HK$1,371.18
HK$1,346.03
檢視
最少： 1
倍數： 1
CIP35
Parker Chomerics 熱介面產品 Thermal Conductive Cure-In-Place Compound, 6W/m-K, 45cc Kit, THERM-A-GAP CIP 60
規格書
無庫存前置作業時間 9 週
HK$178.70
HK$163.58
HK$154.86
HK$146.97
檢視
最少： 1
倍數： 1
CIP 60
Parker Chomerics 熱介面產品 Thermal Conductive Cure-In-Place Compound, 6W/m-K, 200cc Kit, THERM-A-GAP CIP 60
規格書
無庫存前置作業時間 9 週
HK$531.42
HK$512.19
HK$493.69
檢視
最少： 27
倍數： 1
CIP 60
Parker Chomerics 熱介面產品 Thermal Conductive Cure-In-Place Compound, 6W/m-K, 400cc Kit, THERM-A-GAP CIP 60
規格書
無庫存前置作業時間 9 週
HK$1,082.00
HK$1,045.91
HK$1,026.35
檢視
最少： 14
倍數： 1
CIP 60