EdgeLine Connectors

Molex EdgeLine Low-Profile Connectors support up to 25Gbps data rates and are available in multiple orientations and PCB thicknesses from 1.57mm to 3.18mm for use in high-speed transmissions and high-density signal applications. The product line's one-piece solutions are cost-effective as they are only required when a peripheral interface or upgrade card is populated. EdgeLine includes a customizable card-edge interface to enable designers to specify first-mate, last-break designations as well as shorter stubs for high-speed communications. The Molex EdgeLine family delivers a low-cost, flexible, and scalable solution for low-to-mid range telecom, computing, and storage applications.

結果: 3
選擇 圖像 零件編號
 製造商
說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。
數量 RoHS ECAD模型 定位數
間距
電路板厚度
安裝風格
裝配角
觸點电镀
終端類型
系列
Molex 標準卡緣連接器 EdgeLine Vert. Conn., 12.5 Gbps, 0.8mm Pit., 1.57mm PCB Thick., 2 Bays, 278 Pos.
規格書
92庫存量
HK$246.85
HK$165.80
HK$155.36
HK$147.96
最少： 1
倍數： 1
278 Position 0.8 mm Press Fit Vertical Gold 170673
Molex 標準卡緣連接器 EdgeLine Vert. Conn., 12.5 Gbps, 0.8mm Pit., 1.57mm PCB Thick., 1 Bay, 46 Pos.
規格書
暫無庫存
HK$101.43
最少： 792
倍數： 792
46 Position 0.8 mm 1.57 mm Press Fit Vertical Gold Solder Tail 170673
Molex 標準卡緣連接器 EdgeLine Vert. Conn., 12.5 Gbps, 0.8mm Pit., 1.57mm PCB Thick., 2 Bays, 108 Pos.
規格書
暫無庫存
HK$212.82
檢視
最少： 360
倍數： 360
108 Position 0.8 mm Press Fit Vertical Gold 170673