ATS-59007-C1-R0

Advanced Thermal Solutions
984-ATS-59007-C1-R0
ATS-59007-C1-R0

Mfr.:

Description:
Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 35mm Comp, 35x46x16mm

Datasheet:
ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.
More Information
Learn more about Advanced Thermal Solutions ATS-59007-C1-R0

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
Angled Fin
2.42 C/W
46 mm
35 mm
16 mm
Brand: Advanced Thermal Solutions
Color: Black
Packaging: Bulk
Product Type: Heat Sinks
Series: maxiGRIP HS ASM - Custom
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: maxiFLOW maxiGRIP
Type: Component
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

Datasheet

Test/Quality Data

This functionality requires JavaScript to be enabled.

Compliance Codes
CNHTS:
7616991090
CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

In Stock: 100

Stock:
100 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
HK$-.--
Ext. Price:
HK$-.--
Est. Tariff:

Pricing (HKD)

Qty. Unit Price
Ext. Price
HK$213.72 HK$213.72
HK$189.39 HK$1,893.90
HK$180.43 HK$3,608.60
HK$173.85 HK$8,692.50
HK$166.04 HK$16,604.00
HK$157.99 HK$31,598.00
HK$153.71 HK$76,855.00

An unexpected error has occurred.


Have a question? Please visit the Help Centre.
For questions about a specific order, please log in to your account.

If you encounter further problems, please contact us on 800-346-6873 or email help@mouser.com.