結果: 83
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS
Silex Technology 多通訊協定模組 the option to attach an antenna via a trace does not include the u.Fl connector 無庫存前置作業時間 34 週
最少: 1
倍數: 1

Quectel 藍牙模組 - 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105? 無庫存前置作業時間 18 週
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB 無庫存前置作業時間 16 週
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax 無庫存前置作業時間 16 週
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB 無庫存前置作業時間 16 週
最少: 1,000
倍數: 1,000
: 1,000
Quectel 多通訊協定模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax 無庫存前置作業時間 16 週
最少: 1,000
倍數: 1,000
: 1,000
Quectel 多通訊協定模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm 無庫存前置作業時間 18 週
最少: 500
倍數: 500
: 500
Quectel 多通訊協定模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm 無庫存前置作業時間 18 週
最少: 500
倍數: 500
: 500