TE Connectivity Reflow Capable Universal Mate-N-Lok Connectors

TE Connectivity’s (TE) Reflow Capable Universal Mate-N-Lok Connectors are designed to streamline manufacturing processes with simple reflow soldering of PCB assemblies. The reflow-capable universal MATE-N-LOK product line builds on a tested solution for wire-to-board applications. The thermoplastic housing is designed to withstand high temperatures associated with reflow soldering. This allows for an easy transition to a full reflow assembly process. The headers are designed with polarization features, positive locking, and a low contact mating force, allowing for easy mating. The standard .250” (6.35mm) center line allows for mating with TE's existing universal MATE-N-LOK wire-to-board connectors. Applications include HVAC equipment, industrial machinery, appliances, power supplies, security systems, and elevators and escalators.

Features

  • High-temperature, reflow-capable housing allows for transition to reflow PCB assembly
  • Low contact mating force
  • Polarization and positive locking for error-resistant assembly
  • Pin and socket style contacts available

Applications

  • Appliances
  • HVAC equipment
  • Industrial machinery
  • Power supplies
  • Security systems
  • Elevators and escalators

Specifications

  • 12A/600VAC voltage
  • 5000VAC dielectric withstand voltage
  • 6.35mm centerline
  • UL 94V-0 thermoplastic
  • Tin-plated copper alloy
  • -40°C to +105°C operating temperature range
發佈日期: 2017-08-15 | 更新日期: 2025-10-27