Octavo Systems OSD32MP15x System-in-Package (SiP) Devices
Octavo Systems OSD32MP15x System-in-Package (SiP) Devices are based on the STMicroelectronics STM32MP1. The OSD32MP15x delivers all the power of a full microprocessor system in a package that feels like a microcontroller, with a footprint the same size as the ST32MP1 itself.The Octavo Systems System-in-Package integrates the STM32MP15x Dual-Core Arm® Cortex® A7 and an Arm® Cortex® M4, up to 1GB DDR3, STPMIC1 Power Management IC, EEPROM, MEMS Oscillator, and passives into a single BGA package. With a small 18mm x 18mm footprint, the OSD32MP15x offers developers faster designs and a simplified supply chain.
Features
- Integrated into a single BGA Package
- STMicroelectronics STM32MP15x microprocessor SoC with Dual Arm Cortex A7 and Arm Cortex M4
- STPMIC1 Power Management IC (PMIC)
- up to 1GB DDR3L memory
- 4KB non-volatile EEPROM
- Low power MEMS oscillator x2
- Over 100 passives
- Access to all signals of the STM32MP1 TFBGA 361 package
- STPMIC1 Power Management IC Features
- 2.8V to 5.5V single voltage input
- 5.2V integrated boost
- System Power
- Buck LDOx4, power switch x2
- AC adapter, USB, or single cell (1S) Li-Ion/Li-Po battery power in
- 1.8V, 3.3V, and SYS (Switched VIN) power out
- 302 ball BGA (18mm x 18mm)
- ST32MP15x Features
- Arm Cortex-A7 up to 650MHz x2
- Arm Cortex-M4 up to 209MHz
- NEON™SIMD coprocessor x2
- TrustZone®
- USB 2.0 HS + PHY x2
- Ethernet 10/100/1000
- CAN FD/TTCAN x2, UART x4, USART x4,SPI x6, I2C x6, SAI x4, QSPI, SPDIF, I2S x3
- eMMC/SD/SDIO Ports x3
- GPIO x148
- 24-bit RGB display, MIPI DSI
- Camera interface
- 22 channel 16-bit ADC x2, 12-bit DAC x2
- 16 x 16 grid, 1mm pitch
- Case Temperature Range
- 0° to +85°C
- -40° to +85°C
Features Block
Block Diagram
Layout
發佈日期: 2019-09-06
| 更新日期: 2023-07-18
