TE Connectivity IMPACT™高密度背板連接器
TE Connectivity提供IMPACT™連接器系統，能夠滿足未來系統升級與新一代數據網路及電訊設備的更高速度和密度要求。IMPACT高密度背板連結器採用獨特的板邊緣耦合設計，能夠在最佳化的差動對陣列中使用低抗阻的局域化接地回傳路徑。差分對以每線性吋80對緊密耦合，並以接地結構包圍隔離對。這款創新設計令IMPACT高密度背板連結器達到25 Gb/s的數據傳輸率，減少串音和提升整體頻寬表現，以及達到最小的性能差異。TE供應的IMPACT高密度背板連接器是高速背板應用，如交換機、伺服器/刀片式伺服器、存儲裝置和路由器的理想之選。
特點
- Differential pair density up to 80 pairs per linear inch
- Broad-edge-coupled, differential-pair system
- PCB routing complexity and costs are reduced by using 1.90mm x 1.35mm grid on backplane and daughter card
- Flexibility and advanced mechanical and electrical performance with two compliant-pin attach options
- In-line staggered, bifurcated contact beams in daughter card interfaces provides improved mating performance
規格
- 0.75A maximum current rating per pin
- 30VAC/DC maximum operating voltage
- 200 cycles durability
- -55°C to +85°C operating temperature range
Additional Resources
影片
發佈日期: 2011-03-03
| 更新日期: 2025-03-19