TE Connectivity Optical Backplane VITA 66.5 Interconnect Systems

TE Connectivity's Optical Backplane VITA 66.5 Interconnect Systems offer high-bandwidth, high-density, and blind-mate optical interconnect in a backplane/daughtercard configuration. These interconnect systems can accommodate up to three MT ferrules per insert and can support half and full-size modules. The VITA 66.5 interconnect systems are compatible with OpenVPX. These systems feature 7.8N minimum and 11.8N maximum mating force per 12-fiber MT ferrule and 18N minimum and 22N maximum mating force per 24-fiber MT ferrule. The VITA 66.5 interconnect systems are used in processing, radar, embedded computing, avionics, and secure communications applications.

Features

  • Common mounting interface requirements for the various fiber-optic interconnects within 3U and 6U VPX applications
  • High performance:
    • Connectors designed to maximize optical performance, accommodating up to three MT ferrules per insert
    • Receptacle connector insert floats relative to the shell, providing ±0.25mm planar floating alignment capability
  • Durability:
    • 250 cycles (2388438-1 and 2388442-1)
    • 75 cycles (2388440-1 and 2388444-1)
  • Versatile:
    • Full-size connectors
    • Half-size connectors
    • Locating the post function ensures proper position on the backplane and daughtercard
  • 7.8N minimum and 11.8N maximum mating force per 12-fiber MT ferrule
  • 18N minimum and 22N maximum mating force per 24-fiber MT ferrule
  • -40°C to 85°C operating temperature range
  • 50g shock, sawtooth, and 11ms pulse duration (tested per TIA/EIA-455-14, condition E)
  • 1.5mm amplitude (peak-to-peak) sinusoidal vibration, 10Hz to 55Hz, and 2 hours per plane (tested per TIA/EIA-455-11, test condition 1)

Applications

  • Embedded computing
  • Processing Secure communications
  • Avionics and vetronics
  • Radar
  • Imaging and targeting
  • Markets:
    • Military air
    • Defense
    • Commercial air
發佈日期: 2024-08-22 | 更新日期: 2025-01-28