TE Connectivity BMC-Q Automotive Multilayer Chip Beads

TE Connectivity's (TE) BMC-Q Automotive Multilayer Chip Beads are AEC-Q200 qualified and are available in 0402, 0603, 0805, and 1204 packaging sizes. These chip beads are designed with monolithic inorganic material construction, giving them high and ultra-high current capability. BMC-Q series chip beads prevent undesirable noise, producing optimum signal transmission, and these chip beads shield against undesirable power loss for DC voltage applications. TE BMC-Q Automotive Multilayer Chip Beads are suitable for automotive multimedia systems, wireless connection systems, body comfort systems, and automotive low-power systems.