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Octavo Systems OSD335x Complete (C-SiP™) Family of Devices

Octavo Systems OSD335x Complete System-in-Package (C-SiP™) Family of Devices are the most completely integrated 1GHZ Arm® Cortex®-A8 computing platform.  These devices pack everything needed for a powerful embedded computing system in a single 27X27mm BGA package. The OSD335x C-SiP includes a 1GHz Arm Cortex-A8 Sitara™ AM335x processor from Texas Instruments, up to 1GB DDR3 RAM, 4KB EEPROM, 2 power supplies, up to 16GB of eMMC Non-Volatile Flash Memory, a MEMS Oscillator, and over 100 passive components.

Features

  • Integrated into a single BGA Package:
  • TI AM335x Features:
    • Up to 1GHz
    • 8 Channel 12-bit SAR ADC
    • Ethernet 10/100/1000 x2
    • USB 2.0 HS OTG + PHY x2
    • MMC, SD, and SDIO x3
    • LCD controller
    • SGX 3D graphics engine
    • PRU subsystem
  • Access to all AM335x peripherals
    • CAN, SPI, UART, I2C, and GPIO
  • Support for Popular Industrial Protocols:
    • EtherNet/IP
    • Serco III
    • PROFIBUS
    • PROFINET RT/IRT
  • Power In:
    • AC adapter, USB, or single cell (1S) Li-Ion/Li-Po battery
  • Power Out:
    • 1.8V, 3.3V, and SYS (switched VIN)
  • 1.8V or 3.3V selectable AM335x I/O voltage
  • Benefits:
    • A complete embedded system in a single BGA package
    • Integrates over 100 components into one package
    • 50% reduction in board space vs discrete implementation
    • Compatible with AM335x development tools and software
    • Wide BGA ball pitch allows for low-cost assembly
    • Significantly reduces design time
    • Decreases layout complexity
    • Increased reliability through the reduced number of components
  • Package Info:
    • 27mm x 27mm BGA
    • 400 balls (20 x 20 grid) with 1.27mm pitch 
    • 0°C to 85°C and -40°C to 85°C case operating temperature range

Block Diagram

Block Diagram - Octavo Systems OSD335x Complete (C-SiP™) Family of Devices

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發佈日期: 2018-09-07 | 更新日期: 2022-09-27