Laird Technologies Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Solutions

Tgard™ Electrical Insulators are thermally conductive for use where electrical isolation and thermal conductivity is critical.
Tpcm™ High-Performance Products are ideal for applications in which reliability, repeatability, and handling must be controlled to optimize the performance as part of the total thermal solution.
Tpcm 5000 High-Performance TIM features low thermal resistance by coupling high thermal conductivity of 5.3W/mK, minimal bond line thickness, and superior wetting of the mating surfaces.
Tgrease™ High-Performance Products are used in applications where a minimum bond line, constant pressure, and ease of screen printing are desired for optimal performance. Tgrease products are designed to maximize reliability by eliminating pump-out in applications.
Tflex™ Gap Fillers are used to bridge the interface between hot components and a chassis or heat sink assembly. The combination of good thermal conductivity and softness reduces mechanical stress yet maintains thermal performance.
Tputty™ Gap Filler is used to bridge the interface between hot components and a chassis or heat sink assembly when the elimination of mechanical stress or bulk dispensing are critical design considerations.
Tpli™ Gap Filler is used where high thermal conductivity and low pressures are required.
Tgon™ 800 Gap Filler is a high-performance, cost-effective TIM that can be used where electrical isolation is not required.
Tlam™ and Tpreg™ Thermal Printed Circuit Board is a thermally conductive circuit board designed with Laird's unique dielectric materials 1KA, HTD, and LLD.