Infineon Technologies IM69D127 XENSIV™ MEMS Microphone
Infineon Technologies IM69D127 XENSIV™ MEMS Microphone is based on Infineon’s sealed dual membrane MEMS technology, providing high ingress protection (IP57) at a microphone level. The high-performance MEMS microphone is available in a small 3.6mm x 2.5mm package, ideal for compact audio devices like TWS earbuds.
Features
- Very-low self-noise / very-high SNR (69dB)
- Selectable power modes for battery critical applications
- Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
- Very-low group delay (9µs)
- Small package size (3.6mm x 2.5mm x 1mm)
- Very tight part-to-part phase and sensitivity matching (±1dB)
- Flat frequency response with a low LFRO (low-frequency roll-off) of 40Hz
Applications
- TWS earbuds
- ANC headphones
- Laptops and tablets
- Wearables
Block Diagram
Associated Products
Infineon Technologies XENSIV™ MEMS麥克風
設計用於需要低自身雜訊、寬動態範圍和低失真的應用。
Infineon Technologies 直觀感測技術
使用戶能夠與各種智能裝置進行簡單、輕鬆的交互。
Associated Eval Kit
Infineon Technologies XENSIV™ MEMS Microphone Flex Eval Kits
Kit contains five XENSIV™ MEMS microphones mounted on a flex board and one adapter board.
發佈日期: 2022-03-28
| 更新日期: 2024-06-13