ADLINK Technology Express-SL/SLE COM
ADLINK Express-SL/SLE is a COM.0 R2.1 Basic Size Type 6 computer-on-module supporting the 64-bit 6th Generation Intel® Core™, Xeon® E3, and Celeron® processors (formerly "Skylake-H") with Intel® QM170, HM170, CM236 Chipset. The Express-SL/SLE provides outstanding, high-performance graphics processing, reduced development time, and long-lifecycle support. The device features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133MHz with ECC/non-ECC support determined by CPU/chipset combination. This combination ensures the excellent overall performance of the module. High-speed connectivity of the CPU to the Intel QM170, HM170, CM236 Chipset is supported through an Intel Flexible Display Interface and Direct Media Interface.
The integrated Intel Generation 9 Graphics include items such as OpenGL 4.4/4.3/4.2, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC, MPEG2 hardware codec. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-SL/SLE has dual stacked SODIMM sockets supporting up to 32GB of DDR4 ECC/non-ECC memory. In addition, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, eight PCIe x1 Gen3 lanes, USB 3.0 and 2.0 ports, and SATA 6Gb/s ports. Support is provided for SMBus and I²C. SPI AMI EFI BIOS with CMOS backup support the remote console, hardware monitor, watchdog timer, and other embedded features of the module. Applications include automation, medical, and infotainment, with an extended operating temperature range optionally available for transportation and defense applications.
Features
- Intel QM170/HM170/CM236 Chipset
- 6th Gen Intel® Core™, Intel® Xeon®, and Celeron® Processor
- Up to 32GB Dual Channel DDR4 at 1867/2133MHz (supports both ECC and non-ECC memory)
- 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays
- 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
- GbE, 4x SATA 6Gb/s, 4x USB 3.0 and 4x USB 2.0
- Supports Smart Embedded Management Agent (SEMA®) functions
- -40°C to +85°C (build option) Extreme Rugged operating temperature
Applications
- Automation
- Medical
- Infotainment