Molex Impel™背板互連系統
Molex Impel™背板互連系統具備領先業界的訊號完整性及密度，也為日後提升資料傳輸速率提供了可升級的價格與性能。Impel™背板互連系統的尺寸與介面可讓客戶轉移至更快的資料傳輸速率(40 Gbps)，不需徹底重新設計架構或更換資料中心既有的硬體，同時還能滿足業界持續推動的機械密度需求。Impel™背板連接器系統與客製化纜線組件，讓OEM可選擇在現今的資料傳輸速率與成本下操作設備。
The Impel Backplane Interconnect System provides the footprint and interface that will enable customers to migrate to faster data rates (40Gbps), without completely re-designing their architecture or replacing hardware already placed in the data-center, while meeting the mechanical density requirements being driven by the industry. The Impel system of backplane connectors and customized cable assemblies offers OEMs the option for equipment to operate at today's data rates and costs
Molex Impel Plus Backplane Connectors expand the system to achieve data rates up to 56Gbps with superior signal integrity performance and forward compatibility with compact compliant pins.
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Backplane Solutions
Molex Impel Backplane Interconnect System
Achieves signal integrity, density and data rates up to 40 Gbps.
Molex Impel Plus Backplane Connector System
Industry-leading signal integrity, density and data rates up to 56 Gbps.