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Integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components.

Designed for the OSD62x-PM system-in-package with a 4-layer design with no backside components.

Development platform for the OSD32MP15x SiP, which is based on the STMicroelectronics STM32MP1.

Combines the STMicroelectronics STM32MP1 MCU with a graphics process, ADC, and more in BGA package.

Provides OEM and system developers the added benefit of the full industrial temperature range.

Designed for quick evaluation and development with OSD335x-SM family of SiPs.

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