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Ezurio Sterling LWB+ Development Kits

Ezurio Sterling LWB+ Development Kits are designed to quickly demonstrate the functionality and versatility of the Sterling LWB+ Wi-Fi® 4 and BLUETOOTH® 5.2 Modules. The Sterling LWB+ Wi-Fi 4 and Bluetooth 5.2 Modules are based upon the Infineon AIROC™ CYW43439 chipset. The Sterling LWB+ Modules are a System-in-Package (SIP) with two certified module versions, supporting either an onboard chip antenna or an MHF connector for an external antenna. The Sterling LWB+ is intended to meet medical and industrial IoT connectivity requirements.

The Sterling LWB+ Development Kits are available in two versions. The 453-00084-K1 development kit with MHF4 and the 453-00085-K1 development kit with chip antenna.

Features

  • Rich feature-set including 802.11b/g/n Wi-Fi® and Dual-Mode BLUETOOTH®
  • Supports the latest WPA3 security standards
  • 1x1 Wi-Fi 4 (802.11b/g/n)
  • Host Interface:
    • Wi-Fi - SDIO v2.0
    • BT - HS-UART
  • Antenna options:
    • On-board chip antenna
    • MHF4 connector
    • RF Pad
  • Linux Backports package supports many Linux kernels
  • High-quality drivers and extended product life support
  • Bluetooth 5 Bluetooth Low Energy (LE)
  • Advanced Wi-Fi + Bluetooth coexistence for seamless connectivity
  • Extended operating temperature range (-40°C to +85°C)
  • Global certifications/registrations – FCC, ISED, CE, MIC, RCM & Bluetooth SIG
  • Linux, Linux Backports for broad kernel support

Applications

  • Rugged handheld devices
  • Industrial IoT connectivity
  • Medical devices
  • Industrial IoT sensors

Kit Contents

  • Sterling-LWB+ DVK Board (chip antenna or MHF4 connector)
  • 2.4GHz FlexPIFA antenna (MHF4 version only)
  • 10x jumper pin connector

Specifications

  • Wireless
    • Wi-Fi 4 (802.11b/g/n)
    • BLUETOOTH® v5.2, Class 1/2
    • 2.4GHz (Single band) Frequency
    • Transmit Power
      • 802.11b: +18dBm (11Mbps)
      • 802.11g: +16dBm (54Mbps)
      • 802.11n: +15dBm (HT20, MCS7)
    • Receive Sensitivity
      • 802.11b: -94dBm (1Mbps)
      • 802.11g: -90dBm (6Mbps)
      • 802.11n: -89dBm (HT20, MCS0)
  • MHF4, Integrated on-board chip antenna, or RF Pin
  • Up to 65Mbps – MCS7 OFDM (n) PHY link rate (Air)

Associated Products

Ezurio Sterling LWB+ Wi-Fi® 4 & BLUETOOTH® 5.2 Modules

系統封裝 (SIP)，有兩個經過認證的模組版本，以AIROC™ CYW43439晶片組為基礎。

Learn More關於Ezurio Sterling LWB+ Wi-Fi® 4 & BLUETOOTH® 5.2 Modules View Products與Ezurio Sterling LWB+ Wi-Fi® 4 & BLUETOOTH® 5.2 Modules相關

Ezurio 具有BLUETOOTH™ 5模組的Sterling®-LWB5,2+ WiFi 5

使用Sterling LWB+模組設計可靠、安全和節能的IoT設計。

Learn More關於Ezurio 具有BLUETOOTH™ 5模組的Sterling®-LWB5,2+ WiFi 5 View Products與Ezurio 具有BLUETOOTH™ 5模組的Sterling®-LWB5,2+ WiFi 5相關

Ezurio Sterling LWB Wi-Fi® & BLUETOOTH® Modules

Compact modules offing support for IEEE 802.11b/g/n, BT 2.1+EDR, and BLE 4.1 wireless connectivity.

Learn More關於Ezurio Sterling LWB Wi-Fi® & BLUETOOTH® Modules View Products與Ezurio Sterling LWB Wi-Fi® & BLUETOOTH® Modules相關

Associated Dev Tools

Ezurio Sterling™-LWB5+開發套件

透過安全、可靠且穩定的功能組合，實現工業IoT連接。

Learn More關於Ezurio Sterling™-LWB5+開發套件 View Products與Ezurio Sterling™-LWB5+開發套件相關

Overview

Ezurio Sterling LWB+ Development Kits

Videos

發佈日期: 2021-12-16 | 更新日期: 2024-04-02