Bluetooth, BLE 多通訊協定模組

結果: 38
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 產品 封裝
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 5庫存量
最少: 1
倍數: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
NXP Semiconductors 多通訊協定模組 IW610BUK/A1ZDI 25庫存量
最少: 1
倍數: 1
: 2,000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Espressif Systems 多通訊協定模組 SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 1,284庫存量
5,200在途量
最少: 1
倍數: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules
Espressif Systems 多通訊協定模組 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 822庫存量
8,450在途量
最少: 1
倍數: 1

2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 3,479庫存量
6,000預期22/1/2027
最少: 1
倍數: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape


Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 62庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 177庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 110庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 31庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 144庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 23庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 2,626庫存量
最少: 1
倍數: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 840庫存量
600預期22/1/2027
最少: 1
倍數: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 68庫存量
200預期2/10/2026
最少: 1
倍數: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 35庫存量
1,100在途量
最少: 1
倍數: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 287庫存量
400預期17/9/2026
最少: 1
倍數: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 100庫存量
最少: 1
倍數: 1

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Cut Tape
NXP Semiconductors 多通訊協定模組 IW610FUK/A1ZDI 25庫存量
最少: 1
倍數: 1
: 2,000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
4,000預期22/1/2027
最少: 1
倍數: 1
: 1,000

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape, MouseReel
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
998預期18/9/2026
最少: 1
倍數: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,000預期25/9/2026
最少: 1
倍數: 1
: 1,000

MGM240P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Multiprotocol Wireless Module Reel, Cut Tape
NXP Semiconductors 多通訊協定模組 IW610BHN/A1ZDI
25預期29/10/2026
最少: 1
倍數: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Tray
NXP Semiconductors 多通訊協定模組 IW610FHN/A1ZDI
25預期29/10/2026
最少: 1
倍數: 1
: 2,700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Multiprotocol Modules Reel, Cut Tape
Quectel 多通訊協定模組
100在途量
最少: 1
倍數: 1
- 40 C + 85 C 16.6 mm x 13 mm x 2.05 mm Bluetooth, BLE IEEE802.11 a/b/g/n/ac
u-blox 多通訊協定模組 Secure industrial Wi-Fi and Bluetooth u-connectXpress software and internal antenna 暫無庫存
最少: 500
倍數: 500
: 500

NINA-W15 2.4 GHz 8 dBm, 18 dBm GPIO, I2C, I2S, SPI, UART 3.3 V 3.3 V - 40 C + 85 C PCB 10 mm x 14 mm x 2.2 mm Bluetooth, BLE 802.11 b/g/n WiFi, BLE Modules Reel