xGM260P無線模組

Silicon Labs xGM260P Wireless Modules are 2.4GHz frequency devices that deliver excellent RF performance. The MGM260P modules are based on the EFR32MG26 System-on-Chips (SoCs) and support Bluetooth®, Zigbee®, Thread, and Matter protocols. These MGM260P modules feature Secure Vault® technology and support various advanced debugging and development tools. The BGM260P modules are based on the EFR32BG26 SoCs and support Bluetooth Low Energy (BLE) and Bluetooth mesh. These xGM260P wireless modules are ideal for use in light bulbs and designs that require extra PCB layout flexibility.

結果: 6
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - ANT、Thread、Zigbee (802.15.4) 產品 封裝


Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 62庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 177庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 110庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 31庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 144庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs 多通訊協定模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 23庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape