|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-2-K-TR
- Samtec
-
1:
HK$262.88
-
439庫存量
|
Mouser 元件編號
200-LPAM40010S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
439庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-2-K-TR
- Samtec
-
1:
HK$116.23
-
191庫存量
|
Mouser 元件編號
200-LPAM30015L062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
191庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-08-2-K-TR
- Samtec
-
1:
HK$265.83
-
303庫存量
|
Mouser 元件編號
200-LPAM40015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
303庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-2-K-TR
- Samtec
-
1:
HK$224.90
-
380庫存量
|
Mouser 元件編號
200-LPAM40015L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
380庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-1-K-TR
- Samtec
-
1:
HK$307.26
-
139庫存量
|
Mouser 元件編號
200-LPAM50010L081KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
139庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Samtec LPAM-30-01.0-S-06-1-K-TR
- LPAM-30-01.0-S-06-1-K-TR
- Samtec
-
1:
HK$198.60
-
275庫存量
-
新產品
|
Mouser 元件編號
200-LPAM30010S061KTR
新產品
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
275庫存量
|
|
最少: 1
倍數: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-04-2-K-TR
- Samtec
-
1:
HK$112.94
-
203庫存量
|
Mouser 元件編號
200-LPAM20010L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
203庫存量
|
|
最少: 1
倍數: 1
:
475
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Solder
|
Straight
|
|
2.2 A
|
250 VAC
|
|
|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-06-2-K-TR
- Samtec
-
1:
HK$129.79
-
162庫存量
|
Mouser 元件編號
200-LPAM20010L062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
162庫存量
|
|
最少: 1
倍數: 1
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-2-K-TR
- Samtec
-
1:
HK$132.26
-
232庫存量
|
Mouser 元件編號
200-LPAM20015L062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
232庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-2-K-TR
- Samtec
-
1:
HK$129.71
-
160庫存量
|
Mouser 元件編號
200-LPAM30010L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
160庫存量
|
|
最少: 1
倍數: 1
:
475
|
|
|
Plugs
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Straight
|
|
2.2 A
|
250 VAC
|
|
|
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-2-K-TR
- Samtec
-
1:
HK$139.16
-
134庫存量
|
Mouser 元件編號
200-LPAM30010L062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
134庫存量
|
|
最少: 1
倍數: 1
:
325
|
|
|
Headers
|
180 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-2-K-TR
- Samtec
-
1:
HK$237.39
-
143庫存量
-
300預期21/10/2026
|
Mouser 元件編號
200-LPAM40010L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
143庫存量
300預期21/10/2026
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
320 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-06-2-K-TR
- Samtec
-
1:
HK$206.16
-
607庫存量
|
Mouser 元件編號
200-LPAM40015L062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
607庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-06-1-K-TR
- Samtec
-
1:
HK$135.88
-
175庫存量
|
Mouser 元件編號
200-LPAM20015L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
175庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-L-08-2-K-TR
- Samtec
-
1:
HK$220.05
-
61庫存量
-
600在途量
|
Mouser 元件編號
200-LPAM50010L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
61庫存量
600在途量
在途量:
300 預期30/10/2026
300 預期3/2/2027
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
400 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-L-04-2-K-TR
- Samtec
-
1:
HK$112.94
-
120庫存量
|
Mouser 元件編號
200-LPAM20015L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
120庫存量
|
|
最少: 1
倍數: 1
:
450
|
|
|
Headers
|
80 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.5-S-08-2-K-TR
- Samtec
-
1:
HK$181.66
-
2庫存量
|
Mouser 元件編號
200-LPAM20015S082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
2庫存量
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
160 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-04-1-K-TR
- Samtec
-
1:
HK$133.08
-
353庫存量
|
Mouser 元件編號
200-LPAM30010L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
353庫存量
|
|
最少: 1
倍數: 1
:
475
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-2-K-TR
- Samtec
-
1:
HK$135.88
-
18庫存量
|
Mouser 元件編號
200-LPAM30015L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18庫存量
|
|
最少: 1
倍數: 1
:
450
|
|
|
Headers
|
120 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4.5 mm, 5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-2-K-TR
- Samtec
-
1:
HK$189.96
-
18庫存量
|
Mouser 元件編號
200-LPAM40010L062KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
18庫存量
|
|
最少: 1
倍數: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
6 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-1-K-TR
- Samtec
-
1:
HK$85.49
-
573預期6/10/2026
|
Mouser 元件編號
200-LPAM10010L041KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
573預期6/10/2026
|
|
最少: 1
倍數: 1
:
625
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-04-2-K-TR
- Samtec
-
1:
HK$75.30
-
1,220預期11/11/2026
|
Mouser 元件編號
200-LPAM10010L042KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
1,220預期11/11/2026
|
|
最少: 1
倍數: 1
:
625
|
|
|
Headers
|
40 Position
|
1.27 mm (0.05 in)
|
4 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-08-2-K-TR
- Samtec
-
1:
HK$189.96
-
293預期13/11/2026
|
Mouser 元件編號
200-LPAM30010L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
293預期13/11/2026
|
|
最少: 1
倍數: 1
:
325
|
|
|
Headers
|
240 Position
|
1.27 mm (0.05 in)
|
8 Row
|
Crimp
|
Vertical
|
4 mm, 4.5 mm
|
2.2 A
|
250 VAC
|
28 Gbps
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
28 Gbps
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-L-08-2-K-TR
- Samtec
-
1:
HK$313.76
-
243預期22/10/2026
|
Mouser 元件編號
200-LPAM50015L082KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
243預期22/10/2026
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
HK$160.04
-
258預期11/11/2026
|
Mouser 元件編號
200-LPAM30015L061KTR
|
Samtec
|
板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
258預期11/11/2026
|
|
最少: 1
倍數: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
|
LPAM
|
Reel, Cut Tape
|
|