THERM-A-GAP® GEL 50TBL 5W/m-K Thin Bond Line Gels

Parker Chomerics THERM-A-GAP^® GEL 50TBL Thin Bond Line Gels are single-component, fully cured, dispensable gels featuring 5.0W/m-K thermal conductivity and a minimum bond line thickness of 0.002" (0.05mm). The high-performance thermal interface material conducts heat away from electronics to a heat sink or enclosure at ultra-thin bond lines. The 50TBL gels require no mixing or secondary curing, enabling easy application and possible rework. Parker Chomerics THERM-A-GAP GEL 50TBL Thin Bond Line Gels need only ultra-low compressive force to conform under assembly pressure, resulting in minimal stress to components, solder joints, and leads. The gels are suitable for an operating temperature range of -67°C to +392°C.