AD7-30S

Chip Quik
910-AD7-30S
AD7-30S

製造商:

說明:
配液器和儲液瓶 Thermoset Chip Bonding Epoxy (Red) 30g/30cc syringe (Thermal (Heat) Cure Adhesive/Glue)

壽命週期:
新產品:
該製造商的新產品。

庫存量: 34

庫存:
34 可立即送貨
工廠前置作業時間:
5 週 工廠預計生產時間數量大於所顯示的數量。
最少: 1   多個: 1
單價:
HK$-.--
總價:
HK$-.--
估計關稅:

Pricing (HKD)

數量 單價
總價
HK$270.85 HK$270.85

商品屬性 屬性值 選擇屬性
Chip Quik
產品類型: 配液器和儲液瓶
RoHS:  
Syringes
Red
品牌: Chip Quik
產品類型: Bottles & Liquid Dispensers
系列: AD7
原廠包裝數量: 1
子類別: Supplies
找到產品:
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至少選中以上一個核取方塊以顯示在此類別中類似的產品。
所選屬性: 0

CAHTS:
3810100000
USHTS:
3810100000
JPHTS:
381010000
MXHTS:
3810100100
ECCN:
EAR99

AD7 Thermoset Chip Bonding Epoxy

Chip Quik AD7 Thermoset Chip Bonding Epoxy is designed to bond surface-mount chips and ICs to printed circuit boards (PCBs). The AD7 epoxy has low viscosity and is designed to be dot/line dispensed, allowing large and heavy surface-mount components to be permanently bonded to a PCB during reflow. This application enables two-sided mount reflow without larger chips or ICs coming loose. Curing time ranges from 120 to 180 seconds at the recommended curing temperature range of +190°C to +260°C. The maximum recommended dot size for Chip Quik AD7 Epoxy is 10mm x 10mm x 1mm.