ADLINK Technology 工程技術開發工具

開發板及套件 - 其他處理器 I-Pi SMARC Plus Prototype Kit for AIOT and robotics with LEC-RB5-8G-128G-BW-CT, low profile heatsink and i2s WM890 Audio (US 110/220V to 19V Adapter, USB debug cable)

子卡及OEM板 16-CH, 16-bit, 250KS/s Mutifunciton DAQ w/ 2 AO

介面開發工具 The ADi-BACC-G3 is IO extender breakout board by SPI interface. This board has below functions 32x GPI/32x GPO/8x 3A HC GPO/9x Meter sense/1 wire bus/EP_FAIL

介面開發工具 DUAL-PORT ISOLATED CAN INTERFACE CARD

介面開發工具 PCIe-8154 PCIe-8154 4-Axis Motion Controller

開發板及套件 - x86 Starterkit-COM Express 7 with Express-BD7-D1577, 10GbE BaseT Card (Copper), Active heatsink, 2x16GB DDR4 2400 non-ECC SODIMMs, power supply and accessory

開發板及套件 - x86 STARTER KIT FOR TYPE 6 COM EXPRESS

多協議開發工具 Wi-Fi 6E (6GHz), 2x2, Bluetooth 5.2, M.2 2230 module with antenna kit. The module supports dual-stream Wi-Fi in the 2.4GHz, 5GHz and 6GHz bands as well as Bluetooth 5.3. It also supports Wi-Fi 6 R2 features, including UL MU-MIMO1

插座及轉接器 LGA2011 2U Cooler Size:89.7 89.7 64.3 mm Inculding : fan,screw,sink....

開發板及套件 - x86 COM Express formfactor starterkit with Express-BASE7 carrier, 10GbE Full SFP+ Card, power supply and accessory (order COM Express module, memory and thermal solution separately)

開發板及套件 - ARM COM HPC Ampere Altra development kit with module, with Q32-17 CPU, with carrier, heatsink and accessories

硬件調試器 DB30 Multi Purpose Debug Board for SMARC