HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.

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Infineon Technologies MOSFET模組 HybridPACK Drive G2 module 3庫存量
最少: 1
倍數: 1

MOSFET Modules Si Screw Mount HybridPACK
Infineon Technologies MOSFET模組 HybridPACK Drive G2 module 2庫存量
6在途量
最少: 1
倍數: 1

MOSFET Modules Screw Mount HybridPACK N-Channel
Infineon Technologies IGBT 模組 HYBRID PACK DRIVE G2 SI 14庫存量
最少: 1
倍數: 1

IGBT Modules Si Press Fit