HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.

結果: 2
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 技術 安裝風格 封裝/外殼 晶體管極性 Vgs th - 門源門限電壓 最低工作溫度 最高工作溫度 Pd - 功率消耗 封裝
Infineon Technologies MOSFET模組 HybridPACK Drive G2 module 3庫存量
最少: 1
倍數: 1

Si Screw Mount HybridPACK 6.65 V - 40 C + 175 C 750 W Tray
Infineon Technologies MOSFET模組 HybridPACK Drive G2 module 2庫存量
6在途量
最少: 1
倍數: 1

Screw Mount HybridPACK N-Channel - 40 C + 175 C 775 W Tray