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FS13MR12W2M1HB70BPSA1

Name: Infineon FS13MR12W2M1HB70BPSA1
Brand: Infineon Technologies
SKU: 726-FS13MR12W2M1HB70
Price: 1582.35 HKD
Availability: OutOfStock

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Mouser 編號：

726-FS13MR12W2M1HB70

製造商編號：

FS13MR12W2M1HB70BPSA1

製造商：

Infineon Technologies

說明：

離散半導體模組 CoolSiC MOSFET sixpack module 1200 V

規格書:

FS13MR12W2M1HB70BPSA1 規格書 (PDF)

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在途量:: 15

預期5/3/2026
工廠前置作業時間：: 8

週工廠預計生產時間數量大於所顯示的數量。

輸入數量：

最少： 1 多個： 1

單價:

HK$-.--

總價:

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Pricing (HKD)

數量	單價	總價
	HK$1,582.35	HK$1,582.35
	HK$1,472.86	HK$14,728.60
105	報價

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商品屬性	屬性值	選擇屬性
製造商:	Infineon
產品類型:	離散半導體模組
技術:	Si
系列:	M1H
封裝:	Tray
品牌:	Infineon Technologies
產品類型:	Discrete Semiconductor Modules
原廠包裝數量:	15
子類別:	Discrete and Power Modules
公司名稱:	EasyPACK CoolSiC
零件號別名:	FS13MR12W2M1H_B70 SP005561073

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篩選文檔:

規格書

FS13MR12W2M1HB70BPSA1 規格書 (PDF)

CNHTS:: 8504409100
CAHTS:: 8541210000
USHTS:: 8541210095
JPHTS:: 854121000
TARIC:: 8541210000
MXHTS:: 8541210100
ECCN:: EAR99

EasyPACK™ 1B IGBT Power Modules

Infineon Technologies EasyPACK™ 1B IGBT Power Modules are a scalable power module solution with a flexible pin grid system perfect for customizing layout and pinout. The packages are without a base plate enabling use in various applications. The Infineon EasyPACK 1B IGBT power modules cover the full power range from 20A up to 100A at 600V/650V/1200V in PIM or Six-Pack configurations. These modules offer a 135W to 275W power dissipation range and operate from -40°C up to +150°C or +175°C.

1200V CoolSiC™ M1H Modules

Infineon Technologies 1200V CoolSiC™ M1H Modules offer EV Charging and other inverter designers opportunities to achieve never-before-seen efficiency and power density levels.

EasyPACK™ 2B Automotive Power Modules

Infineon Technologies EasyPACK™ 2B Automotive Power Modules offer a 1200V voltage rating, TRENCHSTOP™ technology, and overload operation up to +175°C. These EasyPACK 2B modules provide a platform for different power classes using Si IGBT and CoolSIC™ technologies and feature a flexible package for easy customization to fit the designer's needs due to the ability to add other chip technologies in different topologies. These modules feature housing with integrated mounting clamps to ensure the right pressure of the module to the cooling system over the whole lifetime. Infineon Technologies EasyPACK 2B Automotive Power Modules are designed for hybrid and electric vehicle applications.