HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.

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選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 產品 類型 技術 Vf - 順向電壓 Vr - 反向電壓 Vgs - 閘極-源極電壓 安裝風格 封裝/外殼 最低工作溫度 最高工作溫度 系列 封裝
Infineon Technologies 離散半導體模組 HybridPACK Drive G2 module 3庫存量
最少: 1
倍數: 1

Power Modules Drive G2 Module SiC 1.76 V 400 V Press Fit DIP-7 - 40 C + 175 V HybridPACK Tray
Infineon Technologies 離散半導體模組 HybridPACK Drive G2 module with SiC MOSFET 5庫存量
最少: 1
倍數: 1

SiC MOSFET Modules Bridge Power Module SiC 4.64 V - 5 V, + 19 V Press Fit HybridPACK Tray
Infineon Technologies 離散半導體模組 HYBRID PACK DRIVE G2 SIC 11庫存量
最少: 1
倍數: 1

SiC G2 Tray
Infineon Technologies 離散半導體模組 HYBRID PACK DRIVE G2 SI 9庫存量
最少: 1
倍數: 1

Si G2 Tray
Infineon Technologies 離散半導體模組 HYBRID PACK DRIVE G2 SI 9庫存量
最少: 1
倍數: 1

Si G2 Tray