SMD/SMT 多協議模組

結果: 329
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 封裝
Ezurio 多協議模組 Module, Sona IF513, Antenna Diversity, M.2, Key E, SDIO, UART
200預期17/8/2026
最少: 1
倍數: 1

Sona IF513 2.4 GHz, 5 GHz, 6 GHz 17 dBm SDIO, UART 3.13 V 3.5 V - 40 C + 85 C MHF4L 30 mm x 22 mm x 3.1 mm Bluetooth 5.4, Bluetooth LE WiFi 6E, 802.11 a/b/g/n/ax Tray
Ezurio 多協議模組 Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
1,746預期2/12/2026
最少: 1
倍數: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
GigaDevice 多協議模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 9.5 x 12.4 / 21 GPIO / -40-85 degC / external IPEX connection
800預期29/9/2026
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 12.4 mm x 9.6 mm x 2.4 mm BLE WiFi
GigaDevice 多協議模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-85 degC / onboard PCB antenna
800預期29/9/2026
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.4 dBm UART 3 V 3.6 V - 40 C + 85 C 15 mm x 12.4 mm x 2.4 mm BLE WiFi
GigaDevice 多協議模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
800預期29/9/2026
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
GigaDevice 多協議模組 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
800預期29/9/2026
最少: 1
倍數: 1

RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi
u-blox 多協議模組 IW611, 802.11ax+BT, 2 antenna pins
1,000預期6/8/2026
最少: 1
倍數: 1
: 500

MAYA-W2 18 dBm SPI - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Reel, Cut Tape
Microchip Technology 多協議模組 Wi-Fi + Bluetooth LE Module, Chip Antenna
500預期24/7/2026
最少: 1
倍數: 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Texas Instruments 多協議模組 SimpleLink multipro tocol 2.4-GHz wirele
2,000預期26/10/2026
最少: 1
倍數: 1
: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
1,070預期4/9/2026
最少: 1
倍數: 1

MGM240P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C 12.9 mm x 15 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多協議模組 SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package
400在途量
最少: 1
倍數: 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Advantech 多協議模組 Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, LGA 1620 (Wi-Fi: PCIe/BT:USB) 3庫存量
2預期6/7/2026
最少: 1
倍數: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7
Advantech 多協議模組 Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, Full-size MiniPCIe (Wi-Fi: PCIe/BT:USB)
10在途量
最少: 1
倍數: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7
Microchip Technology 多協議模組 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
144預期24/9/2026
最少: 1
倍數: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
NXP Semiconductors 多協議模組 IW610BHN/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多協議模組 IW610CHN/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors 多協議模組 IW610CUK/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW610FHN/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW610FUK/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW610GUK/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW611HN/A1C
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
NXP Semiconductors 多協議模組 IW612HN/A1I
100預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW612HN 2.4 GHz, 5 GHz I2S Bluetooth 5.2 Reel, Cut Tape
Murata Electronics 多協議模組 Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module Type 2EL
3,988在途量
最少: 1
倍數: 1
: 1,000

2EL 2.4 GHz, 5.8 GHz 20 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Murata Electronics 多協議模組 BT 5.4/WIFI 6
1,000預期20/10/2026
最少: 1
倍數: 1
: 1,000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Murata Electronics 多協議模組 Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
1,000預期12/8/2026
最少: 1
倍數: 1
: 1,000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape