+ 85 C 多協議模組

結果: 577
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - 蜂窩、NBIoT、LTE 協議 - GPS、GLONASS 協議 - Sub GHz 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 資格 封裝
Ezurio 多協議模組 Sterling LWB+, Chip Antenna, CutTape 1,154庫存量
最少: 1
倍數: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Silex Technology 多協議模組 [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo 7庫存量
最少: 1
倍數: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm Bulk
Ezurio 多協議模組 Module, Sterling LWB5+, Chip Antenna 640庫存量
最少: 1
倍數: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO, USB 3.3 V 3.3 V - 40 C + 85 C Chip 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Cut Tape

Silicon Labs 多協議模組 Mighty Gecko ARM Cortex-M4 512 kB flash, 64 kB RAM module 761庫存量
最少: 1
倍數: 1

MGM13P 2.4 GHz 10 dBm I2C, UART, USART 1.8 V 3.8 V - 40 C + 85 C Built-In 12.9 mm x 17.8 mm x 2.3 mm Bluetooth Thread, Zigbee Cut Tape
Insight SiP 多協議模組 nRF52832 LoRa Transceiver & BLE 5 Module AS 61庫存量
最少: 1
倍數: 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Advantech 多協議模組 6E AX210 (Vpro) -40 85 degree wireless k 55庫存量
最少: 1
倍數: 1
2.4 GHz, 5 GHz, 6 GHz PCIe, USB - 40 C + 85 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax
Espressif Systems 多協議模組 SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector.

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Silicon Labs 多協議模組 Mighty Gecko ARM Cortex-M4 256 kB flash, 32 kB RAM module 980庫存量
最少: 1
倍數: 1
: 1,000

2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Chip 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel, Cut Tape, MouseReel
Advantech 多協議模組 Advantech Wi-Fi 7+BT5.3, Qualcomm WCN7851, 2T2R, Full-size MiniPCIe (Wi-Fi: PCIe/BT:USB) 1庫存量
4預期21/7/2026
最少: 1
倍數: 1

AIW-173BQ 6 GHz UART, USB 3 V 3.3 V - 40 C + 85 C MHF4 802.11 b/g/n/ac/ax/be, WiFi 7

Texas Instruments 多協議模組 WL18xxMOD Dual-Band Ind Mod A 595-WL1807 A 595-WL1807MODGIMOCR 262庫存量
最少: 1
倍數: 1
: 250

WL1807MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Telink 多協議模組 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 7庫存量
最少: 1
倍數: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Espressif Systems 多協議模組 SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector, -40 C +105 C 3,506庫存量
最少: 1
倍數: 1
: 6,500
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Reel, Cut Tape
Espressif Systems 多協議模組 SMD module, ESP32-PICO-V3 with 4MB flash die inside, ESP32 ECO V3, PCB antenna, for Alexa Connect Kit (ACK). 477庫存量
最少: 1
倍數: 1
: 650

ESP32 2.4 GHz 19.5 dBm GPIO, I2C, I2S, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 16 mm x 23 mm x 2.3 mm BLE, Bluetooth 4.2 802.11 b/g/n Reel, Cut Tape
Embedded Artists 多協議模組 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM 51庫存量
最少: 1
倍數: 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Ezurio 多協議模組 60 Series, Sterling Module w/u.FL, PCIE/UART 195庫存量
最少: 1
倍數: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Tray
Silex Technology 多協議模組 [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f 10庫存量
最少: 1
倍數: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
Ezurio 多協議模組 Module, Vela IF310, Integrated Antenna, Cut Tape 249庫存量
最少: 1
倍數: 1
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Cut Tape
Ezurio 多協議模組 Module, Vela IF310, MHF4, Cut Tape 250庫存量
最少: 1
倍數: 1
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Cut Tape
Ezurio 多協議模組 Module, Vela IF310, Trace Pin, Cut Tape 250庫存量
最少: 1
倍數: 1
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Cut Tape
Silex Technology 多協議模組 [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108. 15庫存量
最少: 1
倍數: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
DFRobot 多協議模組 ESP32-C3-WROOM-02-N4 Module (PCB antenna) 26庫存量
最少: 1
倍數: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Ezurio 多協議模組 Sterling LWB+, MHF4, Cut Tape 38庫存量
200預期24/11/2026
最少: 1
倍數: 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
DFRobot 多協議模組 ESP32-C3-MINI-1-N4 Module (PCB antenna) 27庫存量
最少: 1
倍數: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Telit Cinterion 多協議模組 181庫存量
392在途量
最少: 1
倍數: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.6 V 4.5 V - 40 C + 85 C 18 mm x 15 mm x 2.6 mm Cellular, NBIoT, LTE GPS Tray
Telit Cinterion 多協議模組 345庫存量
最少: 1
倍數: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Tray