+ 125 C 多協議模組

結果: 38
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 頻率 輸出功率 接口類型 電源電壓 - 最小值 電源電壓 - 最大值 最低工作溫度 最高工作溫度 天線連接器類型 尺寸 協議 - 藍牙、BLE (802.15.1) 協議 - WiFi (802.11) 協議 - ANT、Thread、Zigbee (802.15.4) 封裝
Silicon Labs 多協議模組 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 1,490庫存量
最少: 1
倍數: 1
: 1,000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs 多協議模組 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 380庫存量
最少: 1
倍數: 1
: 1,000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Telink 多協議模組 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 7庫存量
最少: 1
倍數: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Silicon Labs 多協議模組 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified. 200庫存量
最少: 1
倍數: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 125 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
NXP Semiconductors 多協議模組 IW610GHN/A1ZDI 1,240庫存量
最少: 1
倍數: 1

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 276庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 223庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 3,752庫存量
最少: 1
倍數: 1
: 1,000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape


Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 77庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 177庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 174庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module 153庫存量
最少: 1
倍數: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs 多協議模組 Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 1,000庫存量
2,000在途量
最少: 1
倍數: 1
: 1,000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs 多協議模組 Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 269庫存量
1,000在途量
最少: 1
倍數: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Murata Electronics 多協議模組 Shielded Small Wi-Fi 11a/b/g/n/ac/ax 2x2 MIMO + Bluetooth 5.3 Module 556庫存量
最少: 1
倍數: 1
: 1,000

2XS 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UAR 1.71 V 3.46 V - 40 C + 125 C 19.2 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Silicon Labs 多協議模組 Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified. 18庫存量
最少: 1
倍數: 1

MGM210P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多協議模組 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 37庫存量
最少: 1
倍數: 1

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Microchip Technology 多協議模組 Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
144預期24/7/2026
最少: 1
倍數: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
NXP Semiconductors 多協議模組 IW610BHN/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors 多協議模組 IW610BUK/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW610CHN/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors 多協議模組 IW610CUK/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW610FHN/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW610FUK/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors 多協議模組 IW610GUK/A1ZDI
25預期21/8/2026
最少: 1
倍數: 1
: 2,000

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape