+ 85 C Computing 系統模組 - SOM

結果: 492
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 系列 形狀因素 處理器品牌 處理器類型 頻率 最大RAM容量 已安裝RAM 工作電源電壓 接口類型 最低工作溫度 最高工作溫度 尺寸 封裝
Raspberry Pi 系統模組 - SOM CM5108016 8GB RAM 16GB
400預期5/10/2026
最少: 1
倍數: 1
最大: 100

Broadcom BCM2712 8 GB 5 V CSI, DPI, DSI, Ethernet, GPIO, HDMI, I2C, MIPI-CSI-2, MIPI-DSI, PCIe, PCM, SDIO, SPI, UART, USB 2.0 - 20 C + 85 C 55 mm x 40 mm x 4.7 mm Bulk
Raspberry Pi 系統模組 - SOM CM5108032 8GB RAM 32GB
697在途量
最少: 1
倍數: 1

Broadcom BCM2712 8 GB 5 V CSI, DPI, DSI, Ethernet, GPIO, HDMI, I2C, MIPI-CSI-2, MIPI-DSI, PCIe, PCM, SDIO, SPI, UART, USB 2.0 - 20 C + 85 C 55 mm x 40 mm x 4.7 mm Bulk
tinyVision.ai 系統模組 - SOM Vision FPGA SoM 1庫存量
最少: 1
倍數: 1
Vision FPGA SoM Lattice iCE40UP5K 12 MHz 8 MB 8 MB 3.3 V GPIO, I2S 0 C + 85 C 30 mm x 20 mm
Octavo Systems 系統模組 - SOM System-in-Package: ST Micro STM32MP157C Dual ARM Cortex A7 + M4 Processor, 512MB DDR3L, STPMIC1A, 4KB EEPROM, 24MHz Oscillator, Passives - 18mm x 18mm 302 Ball BGA - 0 C to 85 C
336在途量
最少: 1
倍數: 1

OSD32MP15x STMicroelectronics STM32MP157C 209 MHz, 650 MHz 1 GB 512 MB 2.8 V to 5.5 V Camera, CAN, I2C, SAI, SDIO, SPI, UART, USB 0 C + 85 C 18 mm x 18 mm Tray
Octavo Systems 系統模組 - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
400預期10/7/2026
最少: 1
倍數: 1

Texas Instruments AM3358 1 GHz 1 GB 1 GB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Octavo Systems 系統模組 - SOM AM3358 512MB DDR3 System-In-Package
420預期10/7/2026
最少: 1
倍數: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 21 mm x 21 mm Tray
Octavo Systems 系統模組 - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C
2,873在途量
最少: 1
倍數: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 21 mm x 21 mm Tray
Ezurio 系統模組 - SOM Nitrogen93 SMARC SOM: i.MX 93 Dual / 2GB / 16GB eMMC / -40 to +85 C
105預期2/11/2026
最少: 1
倍數: 1

SMARC 2.1.1 i.MX 93 1.7 GHz 4 GB 2 GB 5 V CAN, GPIO, I2C, SPI, UART, USB - 40 C + 85 C 82 mm x 50 mm Tray
Digi 系統模組 - SOM Wi-i.MX6UL SOM Wired 256MB
268預期25/1/2027
最少: 1
倍數: 1

ConnectCore 6UL Digi SMTplus NXP i.MX 6UltraLite-2 528 MHz 1 GB 256 MB 5 V Ethernet, FlexCAN, I2C, I2S/SAI, SDIO, S/PDIF, SPI, UART, USB 2.0 OTG - 40 C + 85 C 29 mm x 29 mm x 3.5 mm
Toradex 系統模組 - SOM 00631102VerdiniMX8MPlusQ4GBIT
Verdin iMX8M plus Verdin NXP i.MX 8M Plus Quad 1.6 GHz 4 GB 3.3 V, 5 V Analog, CAN, I2C, SPI, UART, USB - 40 C + 85 C 69.6 mm x 35 mm x 6 mm
Toradex 系統模組 - SOM 00711200VerdinAM62S512MB

Verdin AM62 Texas Instruments AM625 400 MHz, 1 GHz 1 GB 1 GB 3.3 V, 5 V CAN, GPIO, I2C, I2S, SDIO, SPI, UART - 40 C + 85 C 69.6 mm x 35 mm x 6 mm Bulk
Toradex 系統模組 - SOM 00761200VerdinAM62QGBWBIT

Verdin AM62 Texas Instruments AM623 400 MHz, 1 GHz 512 MB 512 MB 3.3 V, 5 V CAN, GPIO, I2C, I2S, SDIO, SPI, UART - 40 C + 85 C 69.6 mm x 35 mm x 6 mm Bulk
Digi 系統模組 - SOM ConnectCore MP255 STM32MP255C, Dual A35 1.2GHz, M33, GPU, ISP, NPU, 8GB eMMC, 1GB DDR4, -40/+85C
76在途量
最少: 1
倍數: 1

ConnectCore MP2 30 mm x 30 mm 1.5 GHz I2C, SPI, UART - 40 C + 85 C 30 mm x 30 mm x 3 mm
Toradex 系統模組 - SOM 00471105ApalisiMX8QM4GBIT
Apalis iMX8 Apalis NXP i.MX 8QuadMax 1.6 GHz 4 GB 3.3 V Analog, CAN, I2C, IrDA, PCIe, SPI, UART, USB - 40 C + 85 C 82 mm x 45 mm x 6 mm
Trenz Electronic 系統模組 - SOM FPGA-Modul with AMD Artix 7A100T-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
6預期13/1/2027
最少: 1
倍數: 1

4 cm x 5 mm Xilinx XC7A100T-1FGG484I 3.3 V, 5 V Ethernet, JTAG, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 系統模組 - SOM FPGA-Module with AMD Artix 7A200T-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
15預期3/7/2026
最少: 1
倍數: 1

4 cm x 5 mm Xilinx XC7A200T-1FBG484I 3.3 V, 5 V Ethernet, JTAG, QSPI - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 系統模組 - SOM SoC Module with AMD Zynq 7015-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
4預期20/4/2027
最少: 1
倍數: 1

Xilinx XC7Z015-1CLG485I 125 MHz Ethernet, I2C, SPI, USB 2.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 系統模組 - SOM SoC Module with AMD Zynq 7030-1I, 1 GByte DDR3L, 32 MByte Flash, 4 x 5 cm
22在途量
最少: 1
倍數: 1

Xilinx XC7Z030-1SBG485I 125 MHz Ethernet, I2C, SPI, USB 2.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 系統模組 - SOM SoC-Module with AMD Zynq 7020-1Q, 1 GByte DDR3L, 8 GByte eMMC, 4 x 5 cm
37預期18/12/2026
最少: 1
倍數: 1

40 mm x 50 mm Xilinx XA7Z020-1CLG484Q 766 MHz 1 GB 1 GB 3.3 V Ethernet, JTAG, QSPI, USB 2.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 系統模組 - SOM SoC-Module with AMD Zynq 7020-2I, 1 GByte DDR3L, 8 GByte eMMC, 4 x 5 cm
41在途量
最少: 1
倍數: 1

4 cm x 5 cm AMD / Xilinx ARM Cortex A9 1 GB Ethernet, USB - 40 C + 85 C
Trenz Electronic 系統模組 - SOM UltraSOM+ MPSoC Module with Zynq UltraScale+ ZU9EG-2I, 4 GByte DDR4

AMD XCZU9EG-2FFVC900I 4 GB 4 GB - 40 C + 85 C 76 mm x 52 mm

Trenz Electronic 系統模組 - SOM MPSoC Module with AMD Zynq UltraScale+ ZU2CG-1I, 2 GByte DDR4 SDRAM, 4 x 5 cm
3預期4/9/2026
最少: 1
倍數: 1

4 cm x 5 cm AMD XCZU2CG-1SFVC784I 2 GB 2 GB DP, GMII, PCIe, SATA 3.1, USB 3.0 - 40 C + 85 C 50 mm x 40 mm
Trenz Electronic 系統模組 - SOM TE0820-05-4DE81MAS Starter Kit

AMD XCZU4EV-1SFVC784E 0 C + 85 C
Octavo Systems 系統模組 - SOM Complete System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 512MB DDR2, TPS65217C PMIC, TL5209 LDO, 4GB eMMC, 24MHz Oscillator, 4KB EEPROM, Passives - 27mm x 27mm 400 Ball BGA - 0 C to 85 C
120預期25/8/2026
最少: 1
倍數: 1

OSD3358 Texas Instruments AM3358 1 GHz 512 MB 512 MB 1.1 V CAN, Ethernet, GPIO, I2C, SPI, UART, USB 0 C + 85 C 27 mm x 27 mm Tray
Octavo Systems 系統模組 - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C
3預期4/6/2026
最少: 1
倍數: 1

OSDZU3 Standard BGA XCZU3EG1 2 GB 4.5 V to 5.5 V CAN, I2C, SPI, UART, USB - 40 C + 85 C 20.5 mm X 40 mm Tray