114110207

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Mouser 編號：

713-114110207

製造商編號：

114110207

製造商：

Seeed Studio

說明：

單板機 Jetson AGX Orin 32GB H01 Kit with Jetson AGX Orin 32GB Module, 200 TOPs, Wi-Fi, Bluetooth, Aluminum case with cooling fan, Pre-installed JetPack System

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商品屬性	屬性值	選擇屬性
製造商:	Seeed Studio
產品類型:	單板機
付運限制：	Mouser目前不在您的地區出售本產品。
RoHS:
處理器品牌:	NVIDIA
處理器類型:	Jetson AGX Orin
核心:	ARM Cortex A78AE
工作電源電壓:	9 V to 20 V
最低工作溫度:	- 25 C
最高工作溫度:	+ 70 C
尺寸:	107 mm x 106.4 mm x 70.5 mm
品牌:	Seeed Studio
內核數目:	8 Core
板上儲存大小:	64 GB
板上儲存類型:	eMMC
產品類型:	Single Board Computers
子類別:	Computing

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所選屬性: 0

EU Declaration of Conformity (PDF)

CAHTS:: 8471500090
USHTS:: 8471500150
JPHTS:: 847150000
TARIC:: 8471500000
MXHTS:: 8471500100
ECCN:: 5A992.C

Nvidia® Next-Gen Jetson Orin™ Modules

Seeed Studio Nvidia® Next-Gen Jetson Orin™ Modules are powered by the same AI software and cloud-native workflows used across other NVIDIA platforms. At different performance levels, these modules deliver the power efficiency and accelerated computing capabilities needed to build autonomous machines at the edge. The powerful Jetson Software stack also allows users to bring products to market faster. Three series are available: the Jetson AGX Orin, Jetson Orin NX, and Jetson Orin Nano.

Jetson AGX Orin 32GB H01 Module Kit

Seeed Studio Jetson AGX Orin 32GB H01 Module Kit is a powerful solution for AI development, featuring the high-performance Jetson AGX Orin™ 32GB Module. The Seeed Studio kit has a comprehensive carrier board with advanced connectivity options. With 200 TOPs of AI processing power and pre-installed JetPack 5.0.2, this kit provides an alternative to the Jetson AGX Orin Dev Kit. The kit comes with a heatsink and cooling fan, an aluminum case, and an array of ports. The ports include PCIe X16, GbE, 10GbE, USB 3.2, HDMI 2.1, M.2 Key M and E, Wi-Fi®, BLUETOOTH®, MIPI CSI-2, and a 40-pin header.

NVIDIA® Jetson AGX Orin™ Modules

Seeed Studio NVIDIA® Jetson AGX Orin™ Modules provide up to 275 TOPS and 8X the performance (than the last generation) for multiple concurrent AI inference pipelines and high-speed interface support for multiple sensors. Available in 64GB and 32GB versions, the modules offer power configurable from 15W to 60W in the same compact form factor. These modules are ideal for energy-efficient autonomous machines from manufacturing and logistics to retail and healthcare.