ARM Cortex-M33 核心 無線和RF模組

無線和RF模組類型
變更類別視圖
結果: 54
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 製造商
說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。
數量 RoHS 產品類型
產品
頻率
接口類型
協議 - 藍牙、BLE (802.15.1)
協議 - WiFi (802.11)
協議 - ANT、Thread、Zigbee (802.15.4)
協議 - Sub GHz
Quectel 多協議模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
規格書
無庫存前置作業時間 16 週
最少： 1,000
倍數： 1,000
: 1,000
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel 多協議模組 Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
規格書
無庫存前置作業時間 16 週
最少： 1,000
倍數： 1,000
: 1,000
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel 多協議模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
規格書
無庫存前置作業時間 18 週
最少： 500
倍數： 500
: 500
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 802.11a/b/g/n/ac/ax
Quectel 多協議模組 Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
規格書
無庫存前置作業時間 18 週
最少： 500
倍數： 500
: 500
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB