Artificial Intelligence Connectivity Solutions

Samtec Artificial Intelligence (AI) Connectivity Solutions feature an extensive portfolio of high-performance products that support next-generation system designs. These AI solutions are engineered with the complete system in mind, including architectures that demand increased speeds, frequencies, bandwidths, and densities, as well as configurability and scalability. The product lineup consists of high-speed cable assemblies, high-speed board-to-board connectors, high power and signal connectors, and RF cables, assemblies, and connectors. Samtec AI Connectivity Solutions are ideal for next-generation applications, from testing and development to full system optimization support.

結果: 19
選擇 圖像 零件編號 製造商 說明 規格書 供貨情況 定價 (HKD) 基於數量按單價篩選表中結果。 數量 RoHS ECAD模型 產品 定位數 排數 間距 終端類型 觸點电镀 系列 封裝
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 358庫存量
最少: 1
倍數: 1

Headers 64 Position 8 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 305庫存量
最少: 1
倍數: 1

Headers 80 Position 10 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 417庫存量
270預期4/3/2026
最少: 1
倍數: 1

Headers 96 Position 8 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 153庫存量
270預期31/3/2026
最少: 1
倍數: 1

Headers 144 Position 12 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 126庫存量
最少: 1
倍數: 1

Headers 144 Position 12 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 51庫存量
最少: 1
倍數: 1

Headers 48 Position 6 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 17庫存量
最少: 1
倍數: 1

Headers 80 Position 10 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 32工廠有庫存
最少: 1
倍數: 1

Headers 64 Position 8 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 250工廠有庫存
最少: 1
倍數: 1

Headers 72 Position 6 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 50工廠有庫存
最少: 1
倍數: 1

Headers 96 Position 8 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 35工廠有庫存
最少: 1
倍數: 1

Headers 96 Position 8 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 19工廠有庫存
最少: 1
倍數: 1

Headers 120 Position 10 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 23工廠有庫存
最少: 1
倍數: 1

Headers 120 Position 10 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 8工廠有庫存
最少: 1
倍數: 1

Headers 120 Position 10 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 無庫存前置作業時間 2 週
最少: 1
倍數: 1

Headers 80 Position 10 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 無庫存前置作業時間 3 週
最少: 1
倍數: 1

Headers 72 Position 6 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 無庫存前置作業時間 3 週
最少: 1
倍數: 1

Headers 96 Position 8 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 無庫存前置作業時間 4 週
最少: 1
倍數: 1

Headers 144 Position 12 Row 2 mm Solder Pin Gold EBTM Tray
Samtec 高速/模組連接器 ExaMAX 2.00 mm High-Speed Backplane Vertical Header 無庫存前置作業時間 2 週
最少: 1
倍數: 1

Headers 144 Position 12 Row 2 mm Solder Pin Gold EBTM Tray