LPAM-20-01.0-S-08-1-K-TR

Name: Samtec LPAM-20-01.0-S-08-1-K-TR
Brand: Samtec
SKU: 200-LPAM2001.0S081K
Price: 104.97 HKD
Availability: OutOfStock

影像僅供參考
請參閱產品規格

Mouser 編號：

200-LPAM2001.0S081K

製造商編號：

LPAM-20-01.0-S-08-1-K-TR

製造商：

Samtec

說明：

板對板及夾層連接器 .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array

規格書:

LPAM-20-01.0-S-08-1-K-TR 規格書 (PDF)

ECAD模型:

下載免費的庫載入器，為ECAD工具轉換此文件。瞭解更多關於 ECAD 型號的資訊。

供貨情況

庫存：: 暫無庫存

發生意外錯誤了。請稍後再試。
工廠前置作業時間：: 4 週工廠預計生產時間。

輸入數量：

最少： 300 多個： 300

單價:

HK$-.--

總價:

HK$-.--

估計關稅:

此產品免費航運

Pricing (HKD)

數量	單價	總價
完整捲（訂購多個300）
	HK$104.97	HK$31,491.00
	HK$89.84	HK$53,904.00
2,400	報價

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商品屬性	屬性值	選擇屬性
製造商:	Samtec
產品類型:	板對板及夾層連接器
RoHS:	N
系列:	LPAM
封裝:	Reel
品牌:	Samtec
產品類型:	Board to Board & Mezzanine Connectors
原廠包裝數量:	300
子類別:	Board to Board & Mezzanine Connectors
公司名稱:	LP Array

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所選屬性: 0

篩選文檔:

規格書

LPAM-20-01.0-S-08-1-K-TR 規格書 (PDF)

Technical Resources

此功能需要啟用JavaScript。

CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).